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DS2165Q

1.27mm CPLD 5V 28-LCC (J-Lead)


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-DS2165Q
  • Package: 28-LCC (J-Lead)
  • Datasheet: PDF
  • Stock: 286
  • Description: 1.27mm CPLD 5V 28-LCC (J-Lead) (Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 28-LCC (J-Lead)
Surface Mount YES
Operating Temperature 0°C~70°C TA
Packaging Tube
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 28
Type ADPCM
Terminal Finish TIN LEAD
Terminal Position QUAD
Terminal Form J BEND
Peak Reflow Temperature (Cel) 245
Number of Functions 1
Supply Voltage 5V
Terminal Pitch 1.27mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 28
JESD-30 Code S-PQCC-J28
Qualification Status COMMERCIAL
Interface ADPCM, PCM
Operating Mode SYNCHRONOUS
Voltage - I/O 5.00V
Clock Rate 10MHz
Filter NO
Companding Law A/MU-LAW
Height Seated (Max) 4.57mm
Length 11.505mm
Width 11.505mm
RoHS Status Non-RoHS Compliant

DS2165Q Overview


Basically, it is a type of electronic component that is available in a 28-LCC (J-Lead) package.Packaging method Tube is provided.In addition to meeting a wide range of requirements, it is a member of ADPCM.Surface Mount is the direction in which it is mounted.The operation of the device at the temperature of 0°C~70°C TA ensures the normal operation of the device.Voltages can be input or output within 5.00V's analog voltage range.There are 28 terminations for its uses.The supply voltage is 5V.There are pins on the 28 component.In this device, 1 functions are available.

DS2165Q Features


Supplied in the 28-LCC (J-Lead) package

DS2165Q Applications


There are a lot of Rochester Electronics, LLC DS2165Q DSP applications.

  • 3D tomography and imaging processing
  • Signal processing for telecommunications
  • Spectral density estimation
  • Digital image processing, data compression
  • Control systems
  • Infrared
  • Digital image processing
  • Tomography technology
  • Seismology
  • Instrument modeling