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DS2167QN/T&R

CPLD DS2167 28-LCC (J-Lead)


  • Manufacturer: Maxim Integrated
  • Origchip NO: 503-DS2167QN/T&R
  • Package: 28-LCC (J-Lead)
  • Datasheet: PDF
  • Stock: 129
  • Description: CPLD DS2167 28-LCC (J-Lead) (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 28-LCC (J-Lead)
Supplier Device Package 28-PLCC (11.51x11.51)
Operating Temperature 0°C~70°C TA
Packaging Tape & Reel (TR)
Published 2009
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type ADPCM
Base Part Number DS2167
Interface ADPCM, PCM
Voltage - I/O 5.00V
Voltage - Core 5.00V
Clock Rate 10MHz
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

DS2167QN/T&R Overview


In electronic terms, it is a type of component that comes in the package of type 28-LCC (J-Lead) .There is a packaging method of Tape & Reel (TR) provided with it.ADPCM members are well suited for a wide range of applications.In order to mount it, it must be in the direction of Surface Mount.Keeping the device at the temperature of 0°C~70°C TA will ensure that it runs as it should.The digital voltage range of 5.00V refers to the voltage that can be input or output.Many related parts can be identified by using the DS2167 part number as a base.Using Surface Mount as a mounting method, it is mounted.

DS2167QN/T&R Features


Supplied in the 28-LCC (J-Lead) package

DS2167QN/T&R Applications


There are a lot of Maxim Integrated DS2167QN/T&R DSP applications.

  • Seismology
  • Image compression
  • Radar
  • Fourier transform
  • Digital communications
  • Sonar
  • Instrument modeling
  • Sound navigation and ranging systems
  • Automobiles
  • 3D tomography and imaging processing