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DS2176+

24 TerminationsDS2176 Telecom device1 Circuits


  • Manufacturer: Maxim Integrated
  • Origchip NO: 503-DS2176+
  • Package: 24-DIP (0.300, 7.62mm)
  • Datasheet: PDF
  • Stock: 698
  • Description: 24 TerminationsDS2176 Telecom device1 Circuits(Kg)

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Details

Tags

Parameters
Mounting Type Through Hole
Package / Case 24-DIP (0.300, 7.62mm)
Surface Mount NO
Operating Temperature 0°C~70°C
Packaging Tube
Published 1999
JESD-609 Code e3
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 24
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Subcategory Digital Transmission Interfaces
Technology CMOS
Terminal Position DUAL
Peak Reflow Temperature (Cel) 260
Supply Voltage 5V
Terminal Pitch 2.54mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number DS2176
JESD-30 Code R-PDIP-T24
Function Receive Buffer
Qualification Status Not Qualified
Power Supplies 5V
Interface TDM
Number of Circuits 1
Current - Supply 5mA
Data Rate 2048 Mbps
Telecom IC Type ELASTIC BUFFER
Height Seated (Max) 4.572mm
Length 30.545mm
Width 7.62mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free

DS2176+ Overview


In order to save space on the board, 24-DIP (0.300, 7.62mm) packages are used.For telecommunications equipment packing, the Tube method is used.A Through Hole-mount is used for mounting the telecom circuit.Telecommunications equipment consists of 1 circuits.A 0°C~70°C-temperature setting offers reliable performance.There are 24 terminations can be found in telecom switching configuration.A 5V supply voltage is required to operate it.Telecom switching's base part number, DS2176, can be used to find related parts.It adopts ELASTIC BUFFER as its telecom IC type.An electric current of 5mA is supplied to telecom equipment .Among Digital Transmission Interfaces's subcategories, telecommunications device falls.

DS2176+ Features


Available in the 24-DIP (0.300, 7.62mm) package
ELASTIC BUFFER as telecom IC type

DS2176+ Applications


There are a lot of Maxim Integrated DS2176+ Telecom applications.

  • PBXs channel bank
  • T2 Rates PCM Line Interface
  • DECT (Digital European Cordless Telephone) Base Stations
  • High-Density T1/E1/J1 interfaces for Multiplexers
  • E1 Multiplexer
  • Hybrid fiber coax (HFC)
  • T1 Rates PCM Line Interface
  • SONET/SDH terminal
  • Network Multiplexing and Terminating Equipment
  • ISDN Primary Rate Interface