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  • DS31412

DS31412

349 TerminationsTelecom device1 Functions


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-DS31412
  • Package: 349-BGA Exposed Pad
  • Datasheet: PDF
  • Stock: 264
  • Description: 349 TerminationsTelecom device1 Functions(Kg)

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Shipping Cost

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 349-BGA Exposed Pad
Surface Mount YES
Operating Temperature -40°C~85°C
Packaging Tray
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 349
Terminal Finish TIN LEAD
Voltage - Supply 3.135V~3.465V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 240
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 349
JESD-30 Code S-PBGA-B349
Qualification Status COMMERCIAL
Interface LIU
Current - Supply 960mA
Telecom IC Type FRAMER
Height Seated (Max) 2.35mm
Length 27mm
Width 27mm
RoHS Status Non-RoHS Compliant

DS31412 Overview


A 349-BGA Exposed Pad package is used to reduce board space requirements.In order to pack telecommunications equipment, Tray is used.Surface Mount is used as telecommunications equipment mounting type.Telecom circuit is possible to increase efficiency by providing 3.135V~3.465V with a higher voltage.Operating temperatures of -40°C~85°C can ensure reliable performance.As part of its configuration, it includes 349 terminations.With 3.3V as the supply voltage, it operates.It uses the FRAMER IC type for its telecom IC.A current of 960mA is used as the supply current.Telecommunications device is configured wit h 1 functions when designing.349 telecom product pins are designed for its configuration.

DS31412 Features


Available in the 349-BGA Exposed Pad package
FRAMER as telecom IC type

DS31412 Applications


There are a lot of Rochester Electronics, LLC DS31412 Telecom applications.

  • ISDN NT1/TA
  • Channel Banks
  • ISDN Primary Rate Interfaces (PRA)
  • ATM equipment with integrated DS1 interfaces
  • Central office (CO)
  • NIU
  • T1/E1/J1 add/drop multiplexers (MUX)
  • Cable PC
  • E1 Multiplexer
  • T1 Digital Cross Connects (DSX-1)