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DS34S132GN

676 TerminationsDS34S132 Telecom device1 Circuits


  • Manufacturer: Maxim Integrated
  • Origchip NO: 503-DS34S132GN
  • Package: 676-BGA
  • Datasheet: PDF
  • Stock: 909
  • Description: 676 TerminationsDS34S132 Telecom device1 Circuits(Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 676-BGA
Surface Mount YES
Operating Temperature -40°C~85°C
Packaging Tray
Published 2009
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 676
Voltage - Supply 1.8V 3.3V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.8V
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number DS34S132
JESD-30 Code S-PBGA-B676
Function TDM-over-Packet (TDMoP)
Qualification Status Not Qualified
Interface TDMoP
Number of Circuits 1
Telecom IC Type FRAMER
Length 27mm
Width 27mm
RoHS Status Non-RoHS Compliant

DS34S132GN Overview


Saving board space is achieved with the 676-BGA package.To pack telecommunications equipment, the way of Tray is used.The mounting type is Surface Mount.The telecom IC is composed of 1 circuits.A higher supply voltage for 1.8V 3.3V will improve efficiency.A temperature setting of -40°C~85°C ensures reliable performance.676 terminations can be found in the configuration.It operates with a voltage of 1.8V.DS34S132 can be used to locate related parts based on telecom switching's base part number.FRAMER is the type of IC it uses for telecom.

DS34S132GN Features


Available in the 676-BGA package
FRAMER as telecom IC type

DS34S132GN Applications


There are a lot of Maxim Integrated DS34S132GN Telecom applications.

  • PDH Multiplexers
  • Integrated Multi-Service Access Platforms (IMAPs)
  • Voice over packet gateways
  • Set-Top Box
  • Channel Service Units (CSUs): T1/E1/J1
  • Stations
  • Cable Modem
  • DECT (Digital European Cordless Telephone) Base
  • Fractional T1/E1/J1
  • T3 channelized access concentrators