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DSP56303VF100B1

CPLD DSP563xx Series DSP56303 196-LBGA


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-DSP56303VF100B1
  • Package: 196-LBGA
  • Datasheet: PDF
  • Stock: 734
  • Description: CPLD DSP563xx Series DSP56303 196-LBGA (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 196-LBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2005
Series DSP563xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type Fixed Point
Base Part Number DSP56303
Interface Host Interface, SSI, SCI
Voltage - I/O 3.30V
Non-Volatile Memory ROM (576B)
On Chip Data RAM 24kB
Clock Rate 100MHz
RoHS Status Non-RoHS Compliant

DSP56303VF100B1 Overview


The 196-LBGA package contains these electronic components.There is a packaging method of Tray provided with it.In addition to meeting a wide range of requirements, it is a member of Fixed Point.In order to mount it, it must be in the direction of Surface Mount.If it is operating at the temperature of -40°C~100°C TJ, then it will be operating normally.The digital voltage range of 3.30V refers to the voltage that can be input or output.The DSP563xx series contains this digital signal processor.There are a number of related parts that can be identified using the base part number DSP56303.

DSP56303VF100B1 Features


Supplied in the 196-LBGA package

DSP56303VF100B1 Applications


There are a lot of NXP USA Inc. DSP56303VF100B1 DSP applications.

  • Video coding, audio coding
  • Spectral density estimation
  • Seismology
  • Medical imaging
  • Fourier transform
  • Geoscience signal processing
  • Digital image processing
  • Automobiles
  • Tomography technology
  • Other sensor array processing