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DSPA56721AG

0.5mm CPLD 1V LQFP


  • Manufacturer: Freescale Semiconductor, Inc. (NXP Semiconductors)
  • Origchip NO: 318-DSPA56721AG
  • Package: LQFP
  • Datasheet: PDF
  • Stock: 734
  • Description: 0.5mm CPLD 1V LQFP (Kg)

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Details

Tags

Parameters
Package / Case LQFP
Surface Mount YES
JESD-609 Code e3
Moisture Sensitivity Level (MSL) 3
Number of Terminations 144
ECCN Code 3A991
Terminal Finish Matte Tin (Sn)
Additional Feature ALSO REQUIRES 3.3V I/O SUPPLY
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 1V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 144
JESD-30 Code S-PQFP-G144
Operating Temperature (Max) 70°C
Supply Voltage-Max (Vsup) 1.1V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 0.9V
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER
Frequency (Max) 200MHz
Data Bus Width 24b
Halogen Free Halogen Free
Address Bus Width 24
Boundary Scan YES
Low Power Mode NO
Format FIXED POINT
Barrel Shifter NO
Internal Bus Architecture MULTIPLE
Height Seated (Max) 1.6mm
Length 20mm
Radiation Hardening No
RoHS Status RoHS Compliant

DSPA56721AG Overview


An electronic component available in package LQFP.Its uses have 144 terminations.It is supplied with voltage by 1V.In this component, there are pins for 144.Electronic parts can also add more features to ALSO REQUIRES 3.3V I/O SUPPLY.DIGITAL SIGNAL PROCESSOR, OTHER is used as uPs/uCs/peripheral ICs.Below 200MHz should be the maximum value of its frequency.Operating temperatures should not exceed 70°C.

DSPA56721AG Features


Supplied in the LQFP package
DIGITAL SIGNAL PROCESSOR, OTHER as uPs/uCs/Peripheral Ics

DSPA56721AG Applications


There are a lot of Freescale Semiconductor, Inc. (NXP Semiconductors) DSPA56721AG DSP applications.

  • Smart phones
  • Speech signal processing
  • Remote sensing image processing technology
  • Compression of videos
  • Image compression
  • Computers and laptop
  • Spectral density estimation
  • Electronic information engineering
  • 3D tomography and imaging processing
  • Speech processing