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EGM06DRSN-S273

EGM06DRSN-S273 datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Sullins Connector Solutions stock available at Utmel


  • Manufacturer: Sullins Connector Solutions
  • Origchip NO: 765-EGM06DRSN-S273
  • Package: -
  • Datasheet: PDF
  • Stock: 289
  • Description: EGM06DRSN-S273 datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Sullins Connector Solutions stock available at Utmel(Kg)

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Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 3 Weeks
Contact Material Phosphor Bronze
Mount Through Hole
Mounting Type Through Hole
Material - Insulation Polybutylene Terephthalate (PBT)
Operating Temperature -65°C~125°C
Packaging Tray
Published 2016
JESD-609 Code e4
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
Connector Type Loop Bellows
Number of Positions 12
Color Blue
Number of Rows 2
Gender Female
Subcategory Headers and Edge Type Connectors
Contact Type Loop Bellows
Pitch 0.156 3.96mm
Total Number of Contacts 12
Number of Conductors ONE
Contact Finish Gold
Reliability COMMERCIAL
Body Length or Diameter 1.784 inch
Number Of PCB Rows 2
PCB Contact Pattern RECTANGULAR
Body Breadth 0.47 inch
Rated Current (Signal) 3A
Card Type Non Specified - Dual Edge
Read Out Dual
Number of Positions/Bay/Row 6
Contact Finish Thickness 10.0μin 0.25μm
Plating Thickness 10μin
Card Thickness 0.093 2.36mm
Length - Termination 0.19 inch
RoHS Status ROHS3 Compliant
Lead Free Lead Free

EGM06DRSN-S273 Overview


Packaging was done to Tray's specifications.The mounting type Through Hole should be used.Connecting the device to the computer is accomplished by using the connector socket Loop Bellows.

EGM06DRSN-S273 Features



EGM06DRSN-S273 Applications


There are a lot of Sullins Connector Solutions EGM06DRSN-S273 Edgeboard Connectors applications.

  • Battery Operated Systems
  • Data Acquisition Systems
  • Transducer
  • 3-phase power control
  • Multicarrier, multimode digital receivers
  • CMOS Image sensors for mobile applications
  • TD-SCDMA, WiMAX
  • Digital signal processing
  • Scientific instruments.
  • GSM, EDGE, PHS, UMTS, WCDMA, CDMA2000,