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EP3C25F256C8N

1.55mm mm FPGAs Cyclone? III Series 256-LBGA 1mm mm 256


  • Manufacturer: Intel
  • Origchip NO: 386-EP3C25F256C8N
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 417
  • Description: 1.55mm mm FPGAs Cyclone? III Series 256-LBGA 1mm mm 256 (Kg)

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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-LBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Cyclone® III
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code 3A991
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.15V~1.25V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number EP3C25
JESD-30 Code R-PBGA-B256
Number of Outputs 156
Qualification Status Not Qualified
Number of I/O 156
Clock Frequency 472.5MHz
Number of Inputs 156
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 24624
Total RAM Bits 608256
Number of LABs/CLBs 1539
Height Seated (Max) 1.55mm
Length 17mm
Width 17mm
RoHS Status RoHS Compliant

EP3C25F256C8N Overview


There is a 256-LBGA package that includes this component. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 156 I/Os for transferring data in a more coherent manner. A fundamental building block consists of 24624 logic elements/cells. In order for the device to operate, a supply voltage of 1.2V volts needs to be provided. In this case, the FPGA part belongs to the Field Programmable Gate Arrays family. With a Surface Mount connector, this FPGA module can be attached to the development board. In order for it to operate, the supply voltage must be 1.15V~1.25V . FPGAs belonging to the Cyclone? III series are a type of FPGA that belong to the Cyclone? III series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~85°C TJ when operating the machine. In this device, there are 156 outputs that can be used. Using the Tray layout, this FPGA model can be contained in a very small amount of space. Fpga chips is designed wFpga chipsh 256 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 608256 bFpga chipss. Its base part number EP3C25 can be used to find related parts. A total of 1539 LABs/CLBs make up this FPGA array. A crystal oscillating at 472.5MHz is one of the most common components of this device.

EP3C25F256C8N Features


156 I/Os
Up to 608256 RAM bits

EP3C25F256C8N Applications


There are a lot of Intel EP3C25F256C8N FPGAs applications.

  • Aerospace and Defense
  • Medical Applications
  • Image processing
  • Electronic Warfare
  • High Performance Computing
  • Industrial IoT
  • Distributed Monetary Systems
  • Automotive advanced driver assistance systems (ADAS)
  • Video & Image Processing
  • Data Mining