All Products

EP3C25F324C6N

2.2mm mm FPGAs Cyclone? III Series 324-BGA 1mm mm 324


  • Manufacturer: Intel
  • Origchip NO: 386-EP3C25F324C6N
  • Package: 324-BGA
  • Datasheet: PDF
  • Stock: 142
  • Description: 2.2mm mm FPGAs Cyclone? III Series 324-BGA 1mm mm 324 (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 324-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Cyclone® III
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 324
ECCN Code 3A991
Terminal Finish TIN SILVER COPPER
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.15V~1.25V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number EP3C25
JESD-30 Code R-PBGA-B324
Number of Outputs 215
Qualification Status Not Qualified
Number of I/O 215
Clock Frequency 472.5MHz
Number of Inputs 215
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 24624
Total RAM Bits 608256
Number of LABs/CLBs 1539
Height Seated (Max) 2.2mm
Length 19mm
Width 19mm
RoHS Status RoHS Compliant

EP3C25F324C6N Overview


This package is included in the 324-BGA package and is available for purchase. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Having 215 I/Os makes data transfers more coherent. A fundamental building block contains 24624 logic elements or cells. In order to operate fpga chips, a voltage supply of 1.2V volts is required. An FPGA part from the Field Programmable Gate Arrays family. With a Surface Mount connector, this FPGA module can be attached to the development board. A supply voltage of 1.15V~1.25V is needed in order for fpga chips to operate. The FPGA belongs to the Cyclone? III series of FPGAs, and it is one type of FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. In order to make this device as versatile as possible, there are 215 different outputs included. There is an FPGA model contained in Tray in order to conserve space. In total, there are a total of 324 terminations on fpga chips. There are 608256 RAM bits that are available with this device. Its base part number EP3C25 can be used to find related parts. The FPGA consists of 1539 LABs/CLBs. Normally, fpga semiconductor uses an oscillator, which oscillates at 472.5MHz, to create the signal.

EP3C25F324C6N Features


215 I/Os
Up to 608256 RAM bits

EP3C25F324C6N Applications


There are a lot of Intel EP3C25F324C6N FPGAs applications.

  • Security systems
  • Electronic Warfare
  • Development Boards and Shields for Microcontrollers
  • ADAS
  • Artificial intelligence (AI)
  • Video & Image Processing
  • Integrating multiple SPLDs
  • Aircraft navigation
  • Space Applications
  • Camera time adjustments