All Products

EP3C55U484C7

2.05mm mm FPGAs Cyclone? III Series 484-FBGA 0.8mm mm 484


  • Manufacturer: Intel
  • Origchip NO: 386-EP3C55U484C7
  • Package: 484-FBGA
  • Datasheet: PDF
  • Stock: 427
  • Description: 2.05mm mm FPGAs Cyclone? III Series 484-FBGA 0.8mm mm 484 (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 484-FBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Cyclone® III
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
ECCN Code 3A991
Terminal Finish TIN LEAD
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.15V~1.25V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number EP3C55
JESD-30 Code S-PBGA-B484
Number of Outputs 327
Qualification Status Not Qualified
Number of I/O 327
Clock Frequency 472.5MHz
Number of Inputs 327
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 55856
Total RAM Bits 2396160
Number of LABs/CLBs 3491
Height Seated (Max) 2.05mm
Length 19mm
Width 19mm
RoHS Status Non-RoHS Compliant

EP3C55U484C7 Overview


A 484-FBGA package is provided with this component. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. Its 327 I/Os help it transfer data more efficiently. A fundamental building block contains 55856 logic elements or cells. In order for the device to operate, a supply voltage of 1.2V volts needs to be provided. In this case, the FPGA part belongs to the Field Programmable Gate Arrays family. An attachment Surface Mount allows the FPGA module to be attached to the development board. In order for it to operate, the supply voltage must be 1.15V~1.25V . This is a type of FPGA that is part of the Cyclone? III series of FPGAs. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. The device has 327 outputs that are integrated into it. As a result of space limitations, this FPGA model has been included in Tray. The total number of terminations is 484. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 2396160 bFpga chipss. You can find related parts by using the part number EP3C55, which is its base part number. 3491 LABs/CLBs are configured on this FPGA. Fpga semiconductor typically uses a crystal oscillating at 472.5MHz.

EP3C55U484C7 Features


327 I/Os
Up to 2396160 RAM bits

EP3C55U484C7 Applications


There are a lot of Intel EP3C55U484C7 FPGAs applications.

  • Wireless Communications
  • Enterprise networking
  • Automotive driver's assistance
  • Broadcast
  • Data center hardware accelerators
  • Data Mining
  • Aircraft navigation
  • Solar Energy
  • Ecosystem
  • Server Applications