All Products

EP3C5U256C7N

2.2mm mm FPGAs Cyclone? III Series 256-LFBGA 0.8mm mm 256


  • Manufacturer: Intel
  • Origchip NO: 386-EP3C5U256C7N
  • Package: 256-LFBGA
  • Datasheet: PDF
  • Stock: 447
  • Description: 2.2mm mm FPGAs Cyclone? III Series 256-LFBGA 0.8mm mm 256 (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-LFBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Cyclone® III
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code EAR99
Terminal Finish TIN SILVER COPPER
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.15V~1.25V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number EP3C5
JESD-30 Code R-PBGA-B256
Number of Outputs 182
Qualification Status Not Qualified
Number of I/O 182
Clock Frequency 472.5MHz
Number of Inputs 182
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 5136
Total RAM Bits 423936
Number of LABs/CLBs 321
Height Seated (Max) 2.2mm
Length 14mm
Width 14mm
RoHS Status RoHS Compliant

EP3C5U256C7N Overview


In the package 256-LFBGA, this product is provided. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. Fpga chips is programmed wFpga chipsh 182 I/Os for transferring data in a more coherent manner. A fundamental building block consists of 5136 logic elements/cells. 1.2V volts power it. An FPGA part from the Field Programmable Gate Arrays family. FPGA modules can be attached to development boards using a Surface Mount-connector. Fpga chips operates at a voltage of 1.15V~1.25V and uses a battery to supply power. FPGAs belonging to the Cyclone? III series are a type of FPGA that belong to the Cyclone? III series of FPGAs. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. In order to make this device as versatile as possible, there are 182 different outputs included. This FPGA model is contained in Tray for space saving. In total, the terminations of this piece are 256. The RAM bits that this device offer is 423936. EP3C5 is the base part number that can be used to identify related parts. 321 LABs/CLBs are integrated into this FPGA. Usually, fpga semiconductor uses a 472.5MHz crystal.

EP3C5U256C7N Features


182 I/Os
Up to 423936 RAM bits

EP3C5U256C7N Applications


There are a lot of Intel EP3C5U256C7N FPGAs applications.

  • Server Applications
  • Solar Energy
  • Military Temperature
  • Medical ultrasounds
  • Integrating multiple SPLDs
  • Telecommunication
  • Data center hardware accelerators
  • Consumer Electronics
  • Automotive advanced driver assistance systems (ADAS)
  • Distributed Monetary Systems