All Products

EP3CLS200F484C8

2.4mm mm FPGAs Cyclone? III Series 484-BGA 1mm mm 484


  • Manufacturer: Intel
  • Origchip NO: 386-EP3CLS200F484C8
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 148
  • Description: 2.4mm mm FPGAs Cyclone? III Series 484-BGA 1mm mm 484 (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 484-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Cyclone® III
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
ECCN Code 3A991
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.15V~1.25V
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 1.2V
Terminal Pitch 1mm
Base Part Number EP3CLS200
JESD-30 Code S-PBGA-B484
Number of Outputs 210
Qualification Status Not Qualified
Power Supplies 1.21.2/3.32.5V
Number of I/O 210
Clock Frequency 450MHz
Number of Inputs 210
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 198464
Total RAM Bits 8211456
Number of LABs/CLBs 12404
Height Seated (Max) 2.4mm
Length 23mm
Width 23mm
RoHS Status RoHS Compliant

EP3CLS200F484C8 Overview


There are two packages that contain fpga chips: 484-BGA package and X package. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. This device features 210 I/Os in order to transfer data in a more efficient manner. To form a fundamental building block, there are 198464 logic elements/cells. Fpga chips is powered from a supply voltage of 1.2V. This FPGA part belongs to the family of Field Programmable Gate Arrays. FPGA modules can be attached to development boards using a Surface Mount-connector. In order for it to operate, the supply voltage must be 1.15V~1.25V . It is a type of FPGA that belongs to the Cyclone? III series of FPGAs. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. A total of 210 outputs are incorporated into this device. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. The total number of terminations is 484. The RAM bits that this device offer is 8211456. If you are looking for related parts, you can use the base part number EP3CLS200 as a starting point. A total of 12404 LABs/CLBs are included in this FPGA. Power is provided by a 1.21.2/3.32.5V battery that is included with the device. Most of the time, it uses a crystal oscillating at 450MHz to generate the signal.

EP3CLS200F484C8 Features


210 I/Os
Up to 8211456 RAM bits

EP3CLS200F484C8 Applications


There are a lot of Intel EP3CLS200F484C8 FPGAs applications.

  • Automotive advanced driver assistance systems (ADAS)
  • Ecosystem
  • Artificial intelligence (AI)
  • Automotive Applications
  • Data center hardware accelerators
  • Military DSP
  • Distributed Monetary Systems
  • Data Mining
  • Integrating multiple SPLDs
  • Solar Energy