EP3SL70F780C2N

EP3SL70F780C2N Overview

There are two packages that contain fpga chips: 780-BBGA, FCBGA package and X package. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 488 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block contains 67500 logic elements or cells. 0.9V volts power it. There is a Field Programmable Gate Arrays family component in this FPGA part. Using a Surface Mount connector, you can mount this FPGA module on the development board. Fpga chips operates at a voltage of 0.86V~1.15V and uses a battery to supply power. It is a type of FPGA that belongs to the Stratix? III L series of FPGAs. While operating, the operating temperature should be kept within a range of 0°C~85°C TJ. A device such as this one has 488 outputs built into it. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has a total of 780 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 2699264 bFpga chipss. Related parts can be found by using its base part number EP3SL70. 2700 LABs/CLBs are configured on this FPGA. This is a battery operated device that operates on 1.2/3.3V. Most of the time, it uses a crystal oscillating at 800MHz to generate the signal. In addition to this, it is also characteriIT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLYed by a feature called IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY.

EP3SL70F780C2N Features

488 I/Os
Up to 2699264 RAM bits

EP3SL70F780C2N Applications

There are a lot of Intel EP3SL70F780C2N FPGAs applications.

• Distributed Monetary Systems
• Solar Energy
• Voice recognition
• Embedded Vision
• Security systems
• Defense Applications
• Artificial intelligence (AI)
• Industrial IoT
• Ecosystem
• Bioinformatics