All Products

EP4CE22U14I7N

1.5mm mm FPGAs Cyclone? IV E Series 256-LFBGA 0.8mm mm 256


  • Manufacturer: Intel
  • Origchip NO: 386-EP4CE22U14I7N
  • Package: 256-LFBGA
  • Datasheet: PDF
  • Stock: 322
  • Description: 1.5mm mm FPGAs Cyclone? IV E Series 256-LFBGA 0.8mm mm 256 (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-LFBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Cyclone® IV E
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code 3A001.A.7.B
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Voltage - Supply 1.15V~1.25V
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Base Part Number EP4CE22
JESD-30 Code S-PBGA-B256
Number of Outputs 153
Qualification Status Not Qualified
Power Supplies 1.21.2/3.32.5V
Number of I/O 153
Number of Inputs 153
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 22320
Total RAM Bits 608256
Number of LABs/CLBs 1395
Height Seated (Max) 1.5mm
Length 14mm
Width 14mm
RoHS Status RoHS Compliant

EP4CE22U14I7N Overview


There are two packages that contain fpga chips: 256-LFBGA package and X package. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. 153 I/Os are available for transferring data more efficiently. Logic elements/cells form the fundamental building block of a computer. Power is provided by a 1.2V-volt supply. This FPGA part belongs to the family of Field Programmable Gate Arrays. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Fpga chips operates wFpga chipsh a supply voltage of 1.15V~1.25V. This is a type of FPGA that is part of the Cyclone? IV E series of FPGAs. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. There are 153 outputs incorporated in this device. It is for space saving reasons that this FPGA model is contained in Tray. In total, it has 256 terminations on each end. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 608256 bFpga chipss. EP4CE22 is the base part number that can be used to identify related parts. 1395 LABs and CLBs are built into this FPGA. Powered by a 1.21.2/3.32.5V power supply, it can be operated by almost anyone.

EP4CE22U14I7N Features


153 I/Os
Up to 608256 RAM bits

EP4CE22U14I7N Applications


There are a lot of Intel EP4CE22U14I7N FPGAs applications.

  • Cryptography
  • Bioinformatics
  • Scientific Instruments
  • Automotive Applications
  • Development Boards and Shields for Microcontrollers
  • Filtering and communication encoding
  • Data center hardware accelerators
  • Integrating multiple SPLDs
  • ASIC prototyping
  • Secure Communication