All Products

EP4CGX110DF31C7N

2.4mm mm FPGAs Cyclone? IV GX Series 896-BGA 1mm mm 896


  • Manufacturer: Intel
  • Origchip NO: 386-EP4CGX110DF31C7N
  • Package: 896-BGA
  • Datasheet: PDF
  • Stock: 735
  • Description: 2.4mm mm FPGAs Cyclone? IV GX Series 896-BGA 1mm mm 896 (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 896-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Cyclone® IV GX
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 896
Terminal Finish TIN SILVER COPPER
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Voltage - Supply 1.16V~1.24V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number EP4CGX110
JESD-30 Code S-PBGA-B896
Number of Outputs 475
Qualification Status Not Qualified
Power Supplies 1.21.2/3.32.5V
Number of I/O 475
Clock Frequency 472.5MHz
Number of Inputs 475
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 109424
Total RAM Bits 5621760
Number of LABs/CLBs 6839
Height Seated (Max) 2.4mm
Length 31mm
Width 31mm
RoHS Status RoHS Compliant

EP4CGX110DF31C7N Overview


In the 896-BGA package, you will find fpga chips. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. Having 475 I/Os makes data transfers more coherent. A fundamental building block consists of 109424 logic elements/cells. Power is provided by a 1.2V-volt supply. An FPGA part from the Field Programmable Gate Arrays family. The Surface Mount-slot connector on the FPGA module can be connected to the development board. In order for it to operate, the supply voltage must be 1.16V~1.24V . It is a type of FPGA belonging to the Cyclone? IV GX seies. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. In this device, 475 outputs are incorporated in order to provide you with maximum flexibility. In order to save space, this FPGA model has been contained in Tray. As a whole, it has 896 terminations. There are 5621760 RAM bits that are available with this device. Its base part number EP4CGX110 can be used to find parts that are related to it. This FPGA is built as an array of 6839 LABs/CLBs. In order for fpga electronics to work, fpga electronics requires a 1.21.2/3.32.5V power supply. A crystal oscillating at 472.5MHz is one of the most common components of this device.

EP4CGX110DF31C7N Features


475 I/Os
Up to 5621760 RAM bits

EP4CGX110DF31C7N Applications


There are a lot of Intel EP4CGX110DF31C7N FPGAs applications.

  • Image processing
  • Bioinformatics
  • Solar Energy
  • Industrial IoT
  • Space Applications
  • Camera time adjustments
  • Development Boards and Shields for Microcontrollers
  • Filtering and communication encoding
  • ADAS
  • Telecommunication