All Products

EPM1270F256C3

1.5/3.32.5/3.3V 1mm PMIC MAX? II Series EPM1270 2.5V 256-BGA


  • Manufacturer: Intel
  • Origchip NO: 386-EPM1270F256C3
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 231
  • Description: 1.5/3.32.5/3.3V 1mm PMIC MAX? II Series EPM1270 2.5V 256-BGA (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® II
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code 3A991
Terminal Finish TIN LEAD
Additional Feature IT CAN ALSO OPERATE AT 3.3V
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 2.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number EPM1270
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Power Supplies 1.5/3.32.5/3.3V
Supply Voltage-Min (Vsup) 2.375V
Programmable Type In System Programmable
Number of I/O 212
Propagation Delay 6.2 ns
Output Function MACROCELL
Number of Macro Cells 980
JTAG BST YES
Voltage Supply - Internal 2.5V 3.3V
Delay Time tpd(1) Max 6.2ns
Number of Logic Elements/Blocks 1270
Height Seated (Max) 2.2mm
Length 17mm
Width 17mm
RoHS Status Non-RoHS Compliant

EPM1270F256C3 Overview


There are 980 macro cells, which are cells in a mobile phone network that provides radio coverage served by a high-power cell site (tower, antenna or mast).It is contained in package [0].The device is programmed with 212 I/O ports.256terminations have been programmed into the device.Its terminal position is BOTTOM.A voltage of 2.5V is used as the power supply for this device.It is a part of the family [0].It is recommended to package the chip by Tray.A reliable operation is ensured by the operating temperature of [0].It is recommended that the chip be mounted by Surface Mount.It belongs to the MAX? IIseries of FPGAs.It is also possible to find IT CAN ALSO OPERATE AT 3.3Vwhen using this device.In accordance with the [0], its related parts are listed.1270logic blocks/elements are present.The system runs on a power supply of 1.5/3.32.5/3.3V watts.In this case, the maximum supply voltage (Vsup) is 2.625V.There should be a higher supply voltage (Vsup) than 2.375V.

EPM1270F256C3 Features


256-BGA package
212 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.32.5/3.3V power supplies

EPM1270F256C3 Applications


There are a lot of Intel EPM1270F256C3 CPLDs applications.

  • Page register
  • State machine control
  • Power up sequencing
  • DMA control
  • Complex programmable logic devices
  • D/T registers and latches
  • Software-Driven Hardware Configuration
  • Power automation
  • Configurable Addressing of I/O Boards
  • Address decoding