All Products

EPM1270F256C3N

1.5/3.32.5/3.3V 1mm PMIC MAX? II Series EPM1270 2.5V 256-BGA


  • Manufacturer: Intel
  • Origchip NO: 386-EPM1270F256C3N
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 277
  • Description: 1.5/3.32.5/3.3V 1mm PMIC MAX? II Series EPM1270 2.5V 256-BGA (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Power Supplies 1.5/3.32.5/3.3V
Supply Voltage-Min (Vsup) 2.375V
Programmable Type In System Programmable
Number of I/O 212
Propagation Delay 6.2 ns
Output Function MACROCELL
Number of Macro Cells 980
JTAG BST YES
Voltage Supply - Internal 2.5V 3.3V
Delay Time tpd(1) Max 6.2ns
Number of Logic Elements/Blocks 1270
Height Seated (Max) 2.2mm
Length 17mm
Width 17mm
RoHS Status RoHS Compliant
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2003
Series MAX® II
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature IT CAN ALSO OPERATE AT 3.3V
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 2.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number EPM1270
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V

EPM1270F256C3N Overview


980 macrocells are present in the mobile phone network, which offer radio coverage from a high-power cell tower, antenna, or mast.The item is packaged with 256-BGA.In this case, there are 212 I/Os programmed.The device is programmed with 256 terminations.This electrical part is wired with a terminal position of BOTTOM.The power source is powered by 2.5Vvolts.This part is included in Programmable Logic Devices.Trayshould be used for packaging the chip.Ensure its reliability by operating at [0].It is mounted in the way of Surface Mount.In FPGA terms, it is a type of MAX? IIseries FPGA.This device also displays [0].The EPM1270indicates that related parts can be found.There are a total of 1270 logic elements or blocks.It runs on a voltage of 1.5/3.32.5/3.3Vvolts.In this case, the maximum supply voltage (Vsup) is 2.625V.A supply voltage (Vsup) of greater than 2.375V should be used.

EPM1270F256C3N Features


256-BGA package
212 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.32.5/3.3V power supplies

EPM1270F256C3N Applications


There are a lot of Intel EPM1270F256C3N CPLDs applications.

  • Battery operated portable devices
  • Code converters
  • USB Bus
  • Dedicated input registers
  • STANDARD SERIAL INTERFACE UART
  • Configurable Addressing of I/O Boards
  • State machine design
  • I/O expansion
  • SUPERVISORY FUNCTION (LVD AND WATCHDOG)
  • White goods (Washing, Cold, Aircon ,...)