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  • EPM1270F256I5N

EPM1270F256I5N

1.5/3.32.5/3.3V 1mm PMIC MAX? II Series EPM1270 2.5V 256-BGA


  • Manufacturer: Intel
  • Origchip NO: 386-EPM1270F256I5N
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 100
  • Description: 1.5/3.32.5/3.3V 1mm PMIC MAX? II Series EPM1270 2.5V 256-BGA (Kg)

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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2003
Series MAX® II
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code 3A991
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature IT CAN ALSO OPERATE AT 3.3V
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 2.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number EPM1270
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Power Supplies 1.5/3.32.5/3.3V
Supply Voltage-Min (Vsup) 2.375V
Programmable Type In System Programmable
Number of I/O 212
Propagation Delay 10 ns
Output Function MACROCELL
Number of Macro Cells 980
JTAG BST YES
Voltage Supply - Internal 2.5V 3.3V
Delay Time tpd(1) Max 6.2ns
Number of Logic Elements/Blocks 1270
Height Seated (Max) 2.2mm
Length 17mm
Width 17mm
RoHS Status RoHS Compliant

EPM1270F256I5N Overview


A mobile phone network consists of 980macro cells, which are radio coverage cells served by a high-power cell site (tower, antenna or mast).The product is contained in a 256-BGA package.It is programmed with 212 I/Os.The termination of a device is set to [0].Its terminal position is BOTTOM.The power source is powered by 2.5Vvolts.The part is included in Programmable Logic Devices.Trayshould be used for packaging the chip.A reliable operation is ensured by the operating temperature of [0].Chips should be mounted by Surface Mount.The MAX? IIseries FPGA is one of these types.When using this device, IT CAN ALSO OPERATE AT 3.3Vis also available.The EPM1270shows its related parts.There are a total of 1270 logic elements or blocks.A power supply of 1.5/3.32.5/3.3Vvolts is required to operate this device.In order to ensure proper operation, a maximum supply voltage (Vsup) of 2.625V is required.In order to operate properly, the supply voltage (Vsup) should be greater than 2.375V.

EPM1270F256I5N Features


256-BGA package
212 I/Os
The operating temperature of -40°C~100°C TJ
1.5/3.32.5/3.3V power supplies

EPM1270F256I5N Applications


There are a lot of Intel EPM1270F256I5N CPLDs applications.

  • PULSE WIDTH MODULATION (PWM)
  • Storage Cards and Storage Racks
  • POWER-SAVING MODES
  • Multiple DIP Switch Replacement
  • Protection relays
  • PLC analog input modules
  • Boolean function generators
  • ANALOG-TO-DIGITAL CONVERTOR (ADC)
  • Discrete logic functions
  • I/O PORTS (MCU MODULE)