English

All Products

View All >>
  • EPM1270M256C5N

EPM1270M256C5N

1.5/3.32.5/3.3V 0.5mm PMIC MAX? II Series EPM1270 2.5V 256-TFBGA


  • Manufacturer: Intel
  • Origchip NO: 386-EPM1270M256C5N
  • Package: 256-TFBGA
  • Datasheet: PDF
  • Stock: 970
  • Description: 1.5/3.32.5/3.3V 0.5mm PMIC MAX? II Series EPM1270 2.5V 256-TFBGA (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-TFBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® II
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code 3A991
Terminal Finish TIN SILVER COPPER
Additional Feature IT CAN ALSO OPERATE AT 3.3V
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 2.5V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number EPM1270
JESD-30 Code R-PBGA-B256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Power Supplies 1.5/3.32.5/3.3V
Supply Voltage-Min (Vsup) 2.375V
Programmable Type In System Programmable
Number of I/O 212
Propagation Delay 10 ns
Output Function MACROCELL
Number of Macro Cells 980
JTAG BST YES
Voltage Supply - Internal 2.5V 3.3V
Delay Time tpd(1) Max 6.2ns
Number of Logic Elements/Blocks 1270
RoHS Status RoHS Compliant

EPM1270M256C5N Overview


There are 980 macro cells, which are cells in a mobile phone network that provides radio coverage served by a high-power cell site (tower, antenna or mast).The product is contained in a 256-TFBGA package.There are 212 I/Os on the board.It is programmed that device terminations will be 256 .The terminal position of this electrical component is BOTTOM.Power is supplied by a voltage of 2.5V volts.This part is part of the family [0].Trayshould be used to package the chip.A reliable operation is ensured by the operating temperature of [0].It is mounted in the way of Surface Mount.As part of the MAX? IIseries, it is a type of FPGA.The device can also be used to find [0].The EPM1270indicates that related parts can be found.There are 1270 logic elements/blocks.In order for the device to operate, it requires 1.5/3.32.5/3.3V power supplies.Vsup reaches 2.625Vas the maximum supply voltage.It is recommended that the supply voltage (Vsup) be greater than 2.375V.

EPM1270M256C5N Features


256-TFBGA package
212 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.32.5/3.3V power supplies

EPM1270M256C5N Applications


There are a lot of Intel EPM1270M256C5N CPLDs applications.

  • Synchronous or asynchronous mode
  • Timing control
  • I2C BUS INTERFACE
  • Address decoders
  • Page register
  • Wide Vin Industrial low power SMPS
  • SFP, QSFP, QSFP-DD, OSFP, Mini-SAS HD Port Management
  • ROM patching
  • Wireless Infrastructure Base Band Unit and Remote Radio Unit
  • Preset swapping