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  • EPM2210F256A5

EPM2210F256A5

1.5/3.32.5/3.3V 1mm PMIC MAX? II Series EPM2210 256-BGA


  • Manufacturer: Intel
  • Origchip NO: 386-EPM2210F256A5
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 515
  • Description: 1.5/3.32.5/3.3V 1mm PMIC MAX? II Series EPM2210 256-BGA (Kg)

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Shipping Cost

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Operating Temperature -40°C~125°C TJ
Packaging Tray
Series MAX® II
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code 3A001.A.7.A
Terminal Finish TIN LEAD
Additional Feature YES
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number EPM2210
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Power Supplies 1.5/3.32.5/3.3V
Programmable Type In System Programmable
Number of I/O 204
Propagation Delay 11.2 ns
Number of Macro Cells 1700
JTAG BST YES
Voltage Supply - Internal 2.5V 3.3V
Delay Time tpd(1) Max 7ns
Number of Logic Elements/Blocks 2210
RoHS Status RoHS Compliant

EPM2210F256A5 Overview


In the mobile phone network, there are 1700macro cells, which are cells with high-power antennas and towers.256-BGAis the package in which it resides.It is programmed with 204 I/Os.There is a 256terminations set on devices.As the terminal position of this electrical part is [0], it serves as an important access point for passengers or freight.It is a part of family [0].Trayshould be used for packaging the chip.A reliable operation is ensured by the operating temperature of [0].Ideally, the chip should be mounted by Surface Mount.The MAX? IIseries comprises this type of FPGA.This device is also capable of displaying [0].The EPM2210indicates that related parts can be found.There are a total of 2210 logic elements or blocks.A power supply of 1.5/3.32.5/3.3Vis required to operate it.

EPM2210F256A5 Features


256-BGA package
204 I/Os
The operating temperature of -40°C~125°C TJ
1.5/3.32.5/3.3V power supplies

EPM2210F256A5 Applications


There are a lot of Intel EPM2210F256A5 CPLDs applications.

  • Network Interface Card (NIC) and Host Bus Adapter (HBA)
  • State machine control
  • Software Configuration of Add-In Boards
  • Synchronous or asynchronous mode
  • POWER-SAVING MODES
  • Field programmable gate
  • Wireless Infrastructure Base Band Unit and Remote Radio Unit
  • Address decoders
  • I2C BUS INTERFACE
  • Digital designs