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  • EPM2210F256C3N

EPM2210F256C3N

1.5/3.32.5/3.3V 1mm PMIC MAX? II Series EPM2210 2.5V 256-BGA


  • Manufacturer: Intel
  • Origchip NO: 386-EPM2210F256C3N
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 281
  • Description: 1.5/3.32.5/3.3V 1mm PMIC MAX? II Series EPM2210 2.5V 256-BGA (Kg)

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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® II
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code 3A991
Terminal Finish TIN SILVER COPPER
Additional Feature IT CAN ALSO OPERATE AT 3.3V
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 2.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number EPM2210
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Power Supplies 1.5/3.32.5/3.3V
Supply Voltage-Min (Vsup) 2.375V
Programmable Type In System Programmable
Number of I/O 204
Propagation Delay 7 ns
Output Function MACROCELL
Number of Macro Cells 1700
JTAG BST YES
Voltage Supply - Internal 2.5V 3.3V
Delay Time tpd(1) Max 7ns
Number of Logic Elements/Blocks 2210
Height Seated (Max) 2.2mm
Length 17mm
Width 17mm
RoHS Status RoHS Compliant

EPM2210F256C3N Overview


In the mobile phone network, there are 1700macro cells, which are cells with high-power antennas and towers.You can find it in package [0].In this case, there are 204 I/Os programmed.The device is programmed with 256 terminations.This electrical part has a terminal position of BOTTOMand is connected to the ground.A voltage of 2.5V is used as the power supply for this device.It belongs to the family [0].Trayis the packaging method.In order to ensure the reliability of the device, it is designed to operate at a temperature of [0].It is mounted in the way of Surface Mount.FPGAs belonging to the MAX? IIseries contain this type of chip.If you use this device, you will also find [0].Its related parts can be found in the [0].A total of 2210logic elements/blocks are present.A power supply of 1.5/3.32.5/3.3Vis required to operate it.In this case, the maximum supply voltage (Vsup) reaches 2.625V.Vsup (supply voltage) must be greater than 2.375V.

EPM2210F256C3N Features


256-BGA package
204 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.32.5/3.3V power supplies

EPM2210F256C3N Applications


There are a lot of Intel EPM2210F256C3N CPLDs applications.

  • SUPERVISORY FUNCTION (LVD AND WATCHDOG)
  • Preset swapping
  • Programmable power management
  • Code converters
  • Portable digital devices
  • Software-driven hardware configuration
  • Voltage level translation
  • Digital designs
  • Configurable Addressing of I/O Boards
  • ToR/Aggregation/Core Switch and Router