All Products

EPM2210F324C4

1.5/3.32.5/3.3V 1mm PMIC MAX? II Series EPM2210 2.5V 324-BGA


  • Manufacturer: Intel
  • Origchip NO: 386-EPM2210F324C4
  • Package: 324-BGA
  • Datasheet: PDF
  • Stock: 953
  • Description: 1.5/3.32.5/3.3V 1mm PMIC MAX? II Series EPM2210 2.5V 324-BGA (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 324-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® II
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 324
ECCN Code 3A991
Terminal Finish TIN LEAD
Additional Feature IT CAN ALSO OPERATE AT 3.3V
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 2.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number EPM2210
JESD-30 Code S-PBGA-B324
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Power Supplies 1.5/3.32.5/3.3V
Supply Voltage-Min (Vsup) 2.375V
Programmable Type In System Programmable
Number of I/O 272
Propagation Delay 9.1 ns
Output Function MACROCELL
Number of Macro Cells 1700
JTAG BST YES
Voltage Supply - Internal 2.5V 3.3V
Delay Time tpd(1) Max 7ns
Number of Logic Elements/Blocks 2210
Height Seated (Max) 2.2mm
Length 19mm
Width 19mm
RoHS Status Non-RoHS Compliant

EPM2210F324C4 Overview


There are 1700 macro cells in the network, which are high-power cell sites that provide radio coverage (tower, antenna, or mast) for a mobile phone network.It is embedded in the 324-BGA package.As you can see, this device has 272 I/O ports programmed into it.324terminations are programmed into the device.The terminal position of this electrical component is BOTTOM.A voltage of 2.5V is used as the power supply for this device.It is a part of the family [0].It is packaged in the way of Tray.During operation, the operating temperature is kept at 0°C~85°C TJ to ensure its reliability.Mount the chip by Surface Mount.It belongs to the MAX? IIseries of FPGAs.If you use this device, you will also find [0].There are related parts in [0].2210logic elements/blocks exist.It runs on 1.5/3.32.5/3.3Vvolts of power.Supply voltage (Vsup) reaches a maximum of 2.625V.It is important that the supply voltage (Vsup) exceeds 2.375VV.

EPM2210F324C4 Features


324-BGA package
272 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.32.5/3.3V power supplies

EPM2210F324C4 Applications


There are a lot of Intel EPM2210F324C4 CPLDs applications.

  • I2C BUS INTERFACE
  • Network Interface Card (NIC) and Host Bus Adapter (HBA)
  • SFP, QSFP, QSFP-DD, OSFP, Mini-SAS HD Port Management
  • Custom state machines
  • Random logic replacement
  • Synchronous or asynchronous mode
  • TIMERS/COUNTERS
  • Power Meter SMPS
  • Address decoders
  • Interface bridging