English

All Products

View All >>
  • EPM2210GF256C3

EPM2210GF256C3

1.5/3.31.8V 1mm PMIC MAX? II Series EPM2210 1.8V 256-BGA


  • Manufacturer: Intel
  • Origchip NO: 386-EPM2210GF256C3
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 193
  • Description: 1.5/3.31.8V 1mm PMIC MAX? II Series EPM2210 1.8V 256-BGA (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® II
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code 3A991
Terminal Finish TIN LEAD
Additional Feature YES
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 1.8V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number EPM2210
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.89V
Power Supplies 1.5/3.31.8V
Supply Voltage-Min (Vsup) 1.71V
Programmable Type In System Programmable
Number of I/O 204
Propagation Delay 7 ns
Output Function MACROCELL
Number of Macro Cells 1700
JTAG BST YES
Voltage Supply - Internal 1.71V~1.89V
Delay Time tpd(1) Max 7ns
Number of Logic Elements/Blocks 2210
Height Seated (Max) 2.2mm
Length 17mm
Width 17mm
RoHS Status Non-RoHS Compliant

EPM2210GF256C3 Overview


There are 1700 macro cells, which are cells in a mobile phone network that provides radio coverage served by a high-power cell site (tower, antenna or mast).The item is packaged with 256-BGA.There are 204 I/Os programmed in it.It is programmed to terminate devices at [0].The terminal position of this electrical part is BOTTOM, which serves as an important access point for passengers or freight.It is powered by a voltage of 1.8V volts.There is a part in the family [0].It is recommended that the chip be packaged by Tray.In order to ensure the reliability of the device, it is designed to operate at a temperature of [0].The chip should be mounted by Surface Mount.In this case, it is a type of FPGA belonging to the MAX? II series.This device can also display [0].The EPM2210can be used to identify its related parts.2210logic blocks/elements are present.This device runs on 1.5/3.31.8Vvolts of electricity.There is a maximum supply voltage (Vsup) of 1.89V.Voltage supply (Vsup) should be higher than 1.71V.

EPM2210GF256C3 Features


256-BGA package
204 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.31.8V power supplies

EPM2210GF256C3 Applications


There are a lot of Intel EPM2210GF256C3 CPLDs applications.

  • Software Configuration of Add-In Boards
  • Battery operated portable devices
  • ON-CHIP OSCILLATOR CIRCUIT
  • PLC analog input modules
  • Configurable Addressing of I/O Boards
  • Wireless Infrastructure Base Band Unit and Remote Radio Unit
  • STANDARD SERIAL INTERFACE UART
  • Complex programmable logic devices
  • Portable digital devices
  • Digital designs