All Products

EPM2210GF324C3

1.5/3.31.8V 1mm PMIC MAX? II Series EPM2210 1.8V 324-BGA


  • Manufacturer: Intel
  • Origchip NO: 386-EPM2210GF324C3
  • Package: 324-BGA
  • Datasheet: PDF
  • Stock: 924
  • Description: 1.5/3.31.8V 1mm PMIC MAX? II Series EPM2210 1.8V 324-BGA (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 324-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® II
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 324
ECCN Code 3A991
Terminal Finish TIN LEAD
Additional Feature YES
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 1.8V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number EPM2210
JESD-30 Code S-PBGA-B324
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.89V
Power Supplies 1.5/3.31.8V
Supply Voltage-Min (Vsup) 1.71V
Programmable Type In System Programmable
Number of I/O 272
Propagation Delay 7 ns
Output Function MACROCELL
Number of Macro Cells 1700
JTAG BST YES
Voltage Supply - Internal 1.71V~1.89V
Delay Time tpd(1) Max 7ns
Number of Logic Elements/Blocks 2210
Height Seated (Max) 2.2mm
Length 19mm
Width 19mm
RoHS Status Non-RoHS Compliant

EPM2210GF324C3 Overview


1700macrocells exist, which are cells in a mobile phone network that are primarily composed of high-power towers, antennas, or masts.The product is contained in a 324-BGA package.The device has 272inputs and outputs.Terminations of devices are set to [0].BOTTOMis the terminal position of this electrical part.The power supply voltage is 1.8V.This part is in the family [0].The chip should be packaged by Tray.To ensure its reliability, the operating temperature is set to [0].It is recommended to mount the chip by Surface Mount.In FPGA terms, it is a type of MAX? IIseries FPGA.This device also displays [0].The EPM2210indicates that related parts can be found.This logic block consists of 2210logic elements.It runs on a voltage of 1.5/3.31.8Vvolts.1.89Vis the maximum supply voltage (Vsup).If the supply voltage (Vsup) is greater than 1.71V, then the device will work properly.

EPM2210GF324C3 Features


324-BGA package
272 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.31.8V power supplies

EPM2210GF324C3 Applications


There are a lot of Intel EPM2210GF324C3 CPLDs applications.

  • Pattern recognition
  • DDC INTERFACE
  • Protection relays
  • Random logic replacement
  • Handheld digital devices
  • POWER-SAVING MODES
  • Page register
  • Digital systems
  • DMA control
  • Configurable Addressing of I/O Boards