All Products

EPM2210GF324C4N

1.5/3.31.8V 1mm PMIC MAX? II Series EPM2210 1.8V 324-BGA


  • Manufacturer: Intel
  • Origchip NO: 386-EPM2210GF324C4N
  • Package: 324-BGA
  • Datasheet: PDF
  • Stock: 364
  • Description: 1.5/3.31.8V 1mm PMIC MAX? II Series EPM2210 1.8V 324-BGA (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 324-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® II
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 324
ECCN Code 3A991
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature IT CAN ALSO OPERATE AT 3.3V
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.8V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number EPM2210
JESD-30 Code S-PBGA-B324
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.89V
Power Supplies 1.5/3.31.8V
Supply Voltage-Min (Vsup) 1.71V
Programmable Type In System Programmable
Number of I/O 272
Propagation Delay 9.1 ns
Output Function MACROCELL
Number of Macro Cells 1700
JTAG BST YES
Voltage Supply - Internal 1.71V~1.89V
Delay Time tpd(1) Max 7ns
Number of Logic Elements/Blocks 2210
Height Seated (Max) 2.2mm
Length 19mm
Width 19mm
RoHS Status RoHS Compliant

EPM2210GF324C4N Overview


This network has 1700macro cells, which are cells that provide radio coverage provided by a high-power cell site (tower, antenna, mast).324-BGAis the package in which it resides.The device is programmed with 272 I/O ports.It is programmed that device terminations will be 324 .This electrical part is wired with a terminal position of BOTTOM.The power source is powered by 1.8Vvolts.It belongs to the family [0].Trayshould be used to package the chip.A reliable operation is ensured by the operating temperature of [0].It is mounted in the way of Surface Mount.As part of the MAX? IIseries, it is a type of FPGA.When using this device, IT CAN ALSO OPERATE AT 3.3Vis also available.The EPM2210indicates that related parts can be found.This logic element/block contains 2210logic elements.Currently, it is powered by 1.5/3.31.8Vsources.1.89Vis the maximum supply voltage (Vsup).Voltage supply (Vsup) should be higher than 1.71V.

EPM2210GF324C4N Features


324-BGA package
272 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.31.8V power supplies

EPM2210GF324C4N Applications


There are a lot of Intel EPM2210GF324C4N CPLDs applications.

  • LED Lighting systems
  • State machine design
  • Storage Cards and Storage Racks
  • Portable digital devices
  • Pattern recognition
  • Software-Driven Hardware Configuration
  • USB Bus
  • INTERRUPT SYSTEM
  • SFP, QSFP, QSFP-DD, OSFP, Mini-SAS HD Port Management
  • Wireless Infrastructure Base Band Unit and Remote Radio Unit