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EPM570F256C4

1.5/3.32.5/3.3V 1mm PMIC MAX? II Series EPM570 2.5V 256-BGA


  • Manufacturer: Intel
  • Origchip NO: 386-EPM570F256C4
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 844
  • Description: 1.5/3.32.5/3.3V 1mm PMIC MAX? II Series EPM570 2.5V 256-BGA (Kg)

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Shipping Cost

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® II
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code EAR99
Terminal Finish TIN LEAD
Additional Feature IT CAN ALSO OPERATE AT 3.3V
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 2.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number EPM570
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Power Supplies 1.5/3.32.5/3.3V
Supply Voltage-Min (Vsup) 2.375V
Programmable Type In System Programmable
Number of I/O 160
Propagation Delay 7 ns
Output Function MACROCELL
Number of Macro Cells 440
JTAG BST YES
Voltage Supply - Internal 2.5V 3.3V
Delay Time tpd(1) Max 5.4ns
Number of Logic Elements/Blocks 570
Height Seated (Max) 2.2mm
Length 17mm
Width 17mm
RoHS Status Non-RoHS Compliant

EPM570F256C4 Overview


This network has 440macro cells, which are cells that provide radio coverage provided by a high-power cell site (tower, antenna, mast).The item is packaged with 256-BGA.It is equipped with 160I/O ports.256terminations have been programmed into the device.This electrical part is wired with a terminal position of BOTTOM.The device is powered by a voltage of 2.5V volts.It is a part of the family [0].It is recommended to package the chip by Tray.To ensure its reliability, the operating temperature is set to [0].It is recommended to mount the chip by Surface Mount.In FPGA terms, it is a type of MAX? IIseries FPGA.It is also possible to find IT CAN ALSO OPERATE AT 3.3Vwhen using this device.The EPM570shows its related parts.A logic element or block has 570elements.A total of 1.5/3.32.5/3.3V power supplies are needed to run it.The maximal supply voltage (Vsup) reaches 2.625V.A supply voltage (Vsup) of greater than 2.375V should be used.

EPM570F256C4 Features


256-BGA package
160 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.32.5/3.3V power supplies

EPM570F256C4 Applications


There are a lot of Intel EPM570F256C4 CPLDs applications.

  • Configurable Addressing of I/O Boards
  • Parity generators
  • Handheld digital devices
  • Cross-Matrix Switch
  • ToR/Aggregation/Core Switch and Router
  • Preset swapping
  • Pattern recognition
  • Battery operated portable devices
  • I2C BUS INTERFACE
  • Auxiliary Power Supply Isolated and Non-isolated