EPM570GF256C3

EPM570GF256C3 Overview

440 macrocells are present in the mobile phone network, which offer radio coverage from a high-power cell tower, antenna, or mast.The product is contained in a 256-BGA package.There are 160 I/Os on the board.There are 256 terminations, which are the practice of ending a transmission line with a device that matches the characteristic impedance of the line.As the terminal position of this electrical part is [0], it serves as an important access point for passengers and freight.It is powered from a supply voltage of 1.8V.This part is part of the family [0].Trayshould be used for packaging the chip.It operates with the operating temperature of 0°C~85°C TJ to ensure its reliability.It is recommended that the chip be mounted by Surface Mount.The FPGA belongs to the MAX? II series.It is also characterized by YES.In accordance with the [0], its related parts are listed.There are 570 logic elements/blocks, which are fundamental building blocks of field-programmable gate array (FPGA) technology.This device runs on 1.5/3.31.8Vvolts of electricity.1.89Vis the maximum supply voltage (Vsup).Ensure that the supply voltage (Vsup) exceeds 1.71V.

EPM570GF256C3 Features

256-BGA package
160 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.31.8V power supplies

EPM570GF256C3 Applications

There are a lot of Intel EPM570GF256C3 CPLDs applications.

• Digital designs
• Dedicated input registers
• ANALOG-TO-DIGITAL CONVERTOR (ADC)
• Reset swapping
• Cross-Matrix Switch
• PLC analog input modules
• Multiple DIP Switch Replacement
• Power Meter SMPS
• ON-CHIP OSCILLATOR CIRCUIT
• Bootloaders for FPGAs