All Products

EPM570GF256C4

1.5/3.31.8V 1mm PMIC MAX? II Series EPM570 1.8V 256-BGA


  • Manufacturer: Intel
  • Origchip NO: 386-EPM570GF256C4
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 584
  • Description: 1.5/3.31.8V 1mm PMIC MAX? II Series EPM570 1.8V 256-BGA (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® II
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code EAR99
Terminal Finish TIN LEAD
Additional Feature YES
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 1.8V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number EPM570
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.89V
Power Supplies 1.5/3.31.8V
Supply Voltage-Min (Vsup) 1.71V
Programmable Type In System Programmable
Number of I/O 160
Propagation Delay 7 ns
Output Function MACROCELL
Number of Macro Cells 440
JTAG BST YES
Voltage Supply - Internal 1.71V~1.89V
Delay Time tpd(1) Max 5.4ns
Number of Logic Elements/Blocks 570
Height Seated (Max) 2.2mm
Length 17mm
Width 17mm
RoHS Status Non-RoHS Compliant

EPM570GF256C4 Overview


Currently, there are 440 macro cells, which are low-power cell sites (towers, antennas, masts) that serve as radio coverage.The item is enclosed in a 256-BGA package.The device has 160inputs and outputs.256terminations are programmed into the device.The terminal position of this electrical component is BOTTOM.The power source is powered by 1.8Vvolts.It belongs to the family [0].Ideally, the chip should be packaged by Tray.During operation, the operating temperature is kept at 0°C~85°C TJ to ensure its reliability.Ensure that the chip is mounted by Surface Mount.It is a type of FPGA belonging to the MAX? II series.If you use this device, you will also find [0].The EPM570can be used to identify its related parts.There are a total of 570 logic elements or blocks.There is 1.5/3.31.8V power supply available for it.1.89Vis the maximum supply voltage (Vsup).There should be a higher supply voltage (Vsup) than 1.71V.

EPM570GF256C4 Features


256-BGA package
160 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.31.8V power supplies

EPM570GF256C4 Applications


There are a lot of Intel EPM570GF256C4 CPLDs applications.

  • White goods (Washing, Cold, Aircon ,...)
  • STANDARD SERIAL INTERFACE UART
  • Synchronous or asynchronous mode
  • Preset swapping
  • Multiple DIP Switch Replacement
  • Storage Cards and Storage Racks
  • Field programmable gate
  • Power up sequencing
  • Discrete logic functions
  • State machine control