All Products

EPM570GF256C5

1.5/3.31.8V 1mm PMIC MAX? II Series EPM570 1.8V 256-BGA


  • Manufacturer: Intel
  • Origchip NO: 386-EPM570GF256C5
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 571
  • Description: 1.5/3.31.8V 1mm PMIC MAX? II Series EPM570 1.8V 256-BGA (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® II
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code EAR99
Terminal Finish TIN LEAD
Additional Feature YES
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 1.8V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number EPM570
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.89V
Power Supplies 1.5/3.31.8V
Supply Voltage-Min (Vsup) 1.71V
Programmable Type In System Programmable
Number of I/O 160
Propagation Delay 8.7 ns
Output Function MACROCELL
Number of Macro Cells 440
JTAG BST YES
Voltage Supply - Internal 1.71V~1.89V
Delay Time tpd(1) Max 5.4ns
Number of Logic Elements/Blocks 570
Height Seated (Max) 2.2mm
Length 17mm
Width 17mm
RoHS Status Non-RoHS Compliant

EPM570GF256C5 Overview


The mobile phone network has 440 macro cells, which are cells that provide radio coverage from high-power cell sites (towers, antennas, or masts).It is embedded in the 256-BGA package.As you can see, this device has 160 I/O ports programmed into it.Terminations of devices are set to [0].The terminal position of this electrical part is BOTTOM, which serves as an important access point for passengers or freight.Power is provided by a supply voltage of 1.8V volts.This part is included in Programmable Logic Devices.It is recommended that the chip be packaged by Tray.The operating temperature of the machine is 0°C~85°C TJ to ensure its reliability.It is mounted in the way of Surface Mount.The MAX? IIseries comprises this type of FPGA.This device is also capable of displaying [0].According to the EPM570, its related parts can be found.In total, there are 570 logic elements/blocks.In order for the device to operate, it requires 1.5/3.31.8V power supplies.1.89Vrepresents the maximal supply voltage (Vsup).A supply voltage (Vsup) of greater than 1.71V should be used.

EPM570GF256C5 Features


256-BGA package
160 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.31.8V power supplies

EPM570GF256C5 Applications


There are a lot of Intel EPM570GF256C5 CPLDs applications.

  • Page register
  • I/O expansion
  • Portable digital devices
  • Digital systems
  • Code converters
  • ToR/Aggregation/Core Switch and Router
  • Multiple Clock Source Selection
  • Address decoders
  • POWER-SAVING MODES
  • Parity generators