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  • EPM7064LC68-12YY

EPM7064LC68-12YY

PMIC MAX? 7000 Series


  • Manufacturer: Intel
  • Origchip NO: 386-EPM7064LC68-12YY
  • Package: -
  • Datasheet: PDF
  • Stock: 617
  • Description: PMIC MAX? 7000 Series (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Supplier Device Package 68-PLCC (24x24)
Operating Temperature 0°C~70°C TA
Packaging Tray
Series MAX® 7000
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Programmable Type EE PLD
Number of I/O 52
Number of Gates 1250
Number of Macro Cells 64
Voltage Supply - Internal 4.75V~5.25V
Delay Time tpd(1) Max 12ns
Number of Logic Elements/Blocks 4

EPM7064LC68-12YY Overview


There are 64 macro cells in the network, which are high-power cell sites that provide radio coverage (tower, antenna, or mast) for a mobile phone network.There are 52 I/Os on the board.It is recommended that the chip be packaged by Tray.To ensure its reliability, the operating temperature is set to [0].Chips should be mounted by Surface Mount.The MAX? 7000series comprises this type of FPGA.It is possible to construct digital circuits using 1250gates, which are devices that serve as building blocks.4logic elements/blocks exist.

EPM7064LC68-12YY Features


52 I/Os
The operating temperature of 0°C~70°C TA

EPM7064LC68-12YY Applications


There are a lot of Intel EPM7064LC68-12YY CPLDs applications.

  • Preset swapping
  • INTERRUPT SYSTEM
  • Protection relays
  • High speed graphics processing
  • ToR/Aggregation/Core Switch and Router
  • Software-driven hardware configuration
  • Interface bridging
  • Handheld digital devices
  • Multiple DIP Switch Replacement
  • Auxiliary Power Supply Isolated and Non-isolated