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  • EPM7128BFC169-10

EPM7128BFC169-10

PMIC MAX? 7000B Series 169-LFBGA


  • Manufacturer: Intel
  • Origchip NO: 386-EPM7128BFC169-10
  • Package: 169-LFBGA
  • Datasheet: PDF
  • Stock: 626
  • Description: PMIC MAX? 7000B Series 169-LFBGA (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 169-LFBGA
Supplier Device Package 169-UBGA (11x11)
Operating Temperature 0°C~70°C TA
Packaging Tray
Series MAX® 7000B
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Programmable Type In System Programmable
Number of I/O 100
Number of Gates 2500
Number of Macro Cells 128
Voltage Supply - Internal 2.375V~2.625V
Delay Time tpd(1) Max 10ns
Number of Logic Elements/Blocks 8

EPM7128BFC169-10 Overview


A mobile phone network consists of 128macro cells, which are radio coverage cells served by a high-power cell site (tower, antenna or mast).In the 169-LFBGApackage, you will find it.It is equipped with 100I/O ports.It is recommended that the chip be packaged by Tray.A reliable operation is ensured by the operating temperature of [0].It is mounted in the way of Surface Mount.In terms of FPGAs, it belongs to the MAX? 7000B series.A digital circuit can be constructed using 2500gates.A logic element or block has 8elements.

EPM7128BFC169-10 Features


169-LFBGA package
100 I/Os
The operating temperature of 0°C~70°C TA

EPM7128BFC169-10 Applications


There are a lot of Intel EPM7128BFC169-10 CPLDs applications.

  • Cross-Matrix Switch
  • Timing control
  • Power up sequencing
  • Wide Vin Industrial low power SMPS
  • ROM patching
  • Synchronous or asynchronous mode
  • Digital designs
  • Field programmable gate
  • Software-driven hardware configuration
  • Protection relays