All Products

EPM7512AEFC256-10N

2.5/3.33.3V 1mm PMIC MAX? 7000A Series EPM7512 3.3V 256-BGA


  • Manufacturer: Intel
  • Origchip NO: 386-EPM7512AEFC256-10N
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 938
  • Description: 2.5/3.33.3V 1mm PMIC MAX? 7000A Series EPM7512 3.3V 256-BGA (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Operating Temperature 0°C~70°C TA
Packaging Tray
Series MAX® 7000A
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code 3A991
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number EPM7512
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 2.5/3.33.3V
Supply Voltage-Min (Vsup) 3V
Programmable Type In System Programmable
Number of I/O 212
Clock Frequency 87MHz
Propagation Delay 10 ns
Number of Gates 10000
Output Function MACROCELL
Number of Macro Cells 512
JTAG BST YES
Voltage Supply - Internal 3V~3.6V
Delay Time tpd(1) Max 10ns
Number of Logic Elements/Blocks 32
Height Seated (Max) 2.1mm
Length 17mm
Width 17mm
RoHS Status RoHS Compliant

EPM7512AEFC256-10N Overview


There are 512 macro cells, which provide radio coverage via high-power cell towers, antennas or masts in a mobile phone network.The item is packaged with 256-BGA.There are 212 I/Os on the board.It is programmed that device terminations will be 256 .This electrical part has a terminal position of BOTTOMand is connected to the ground.A voltage of 3.3V is used as the power supply for this device.There is a part in the family [0].Package the chip by Tray.To ensure reliability, the device operates at a temperature of [0].Ensure that the chip is mounted by Surface Mount.It belongs to the MAX? 7000Aseries of FPGAs.In accordance with the [0], its related parts are listed.It is possible to construct digital circuits using 10000gates, which are devices that serve as building blocks.32logic blocks/elements are present.Currently, it is powered by 2.5/3.33.3Vsources.3.6Vrepresents the maximal supply voltage (Vsup).In order to operate properly, the supply voltage (Vsup) should be greater than 3V.This device should not have an clock frequency greater than 87MHz.

EPM7512AEFC256-10N Features


256-BGA package
212 I/Os
The operating temperature of 0°C~70°C TA
2.5/3.33.3V power supplies

EPM7512AEFC256-10N Applications


There are a lot of Intel EPM7512AEFC256-10N CPLDs applications.

  • Bootloaders for FPGAs
  • Custom state machines
  • Battery operated portable devices
  • Cross-Matrix Switch
  • Preset swapping
  • Interface bridging
  • DDC INTERFACE
  • Power up sequencing
  • Digital systems
  • Complex programmable logic devices