English

All Products

View All >>
  • EPM7512BFI256-7

EPM7512BFI256-7

1.8/3.32.5V 1mm PMIC MAX? 7000B Series EPM7512 2.5V 256-BGA


  • Manufacturer: Intel
  • Origchip NO: 386-EPM7512BFI256-7
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 218
  • Description: 1.8/3.32.5V 1mm PMIC MAX? 7000B Series EPM7512 2.5V 256-BGA (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Operating Temperature -40°C~85°C TA
Packaging Tray
Series MAX® 7000B
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code 3A991
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature YES
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 2.5V
Terminal Pitch 1mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number EPM7512
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Power Supplies 1.8/3.32.5V
Supply Voltage-Min (Vsup) 2.375V
Programmable Type In System Programmable
Number of I/O 212
Clock Frequency 163.9MHz
Propagation Delay 5.5 ns
Number of Gates 10000
Output Function MACROCELL
Number of Macro Cells 512
JTAG BST YES
Voltage Supply - Internal 2.375V~2.625V
Delay Time tpd(1) Max 7.5ns
Number of Logic Elements/Blocks 32
Height Seated (Max) 3.5mm
Length 17mm
Width 17mm
RoHS Status Non-RoHS Compliant

EPM7512BFI256-7 Overview


This network has 512macro cells, which are cells that provide radio coverage provided by a high-power cell site (tower, antenna, mast).It is contained in package [0].There are 212 I/Os programmed in it.Terminations of devices are set to [0].As the terminal position of this electrical part is [0], it serves as an important access point for passengers and freight.It is powered from a supply voltage of 2.5V.It is included in Programmable Logic Devices.The chip should be packaged by Tray.To ensure its reliability, the operating temperature is set to [0].The chip should be mounted by Surface Mount.The MAX? 7000Bseries FPGA is one of these types.This device also displays [0].There are related parts in [0].10000gates are devices that serve as building blocks for digital circuits.A logic element or block has 32elements.It runs on 1.8/3.32.5Vvolts of power.Vsup reaches 2.625Vas the maximum supply voltage.It should be possible for Vsup to exceed 2.375Vat the supply voltage.The clock frequency of this device should not exceed 163.9MHz.

EPM7512BFI256-7 Features


256-BGA package
212 I/Os
The operating temperature of -40°C~85°C TA
1.8/3.32.5V power supplies

EPM7512BFI256-7 Applications


There are a lot of Intel EPM7512BFI256-7 CPLDs applications.

  • Bootloaders for FPGAs
  • High speed graphics processing
  • Software-Driven Hardware Configuration
  • Discrete logic functions
  • ROM patching
  • Software-driven hardware configuration
  • ANALOG-TO-DIGITAL CONVERTOR (ADC)
  • Interface bridging
  • USB Bus
  • Field programmable gate