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  • EPM7512BUC169-10

EPM7512BUC169-10

1.8/3.32.5V 0.8mm PMIC MAX? 7000B Series EPM7512 2.5V 169-LFBGA


  • Manufacturer: Intel
  • Origchip NO: 386-EPM7512BUC169-10
  • Package: 169-LFBGA
  • Datasheet: PDF
  • Stock: 481
  • Description: 1.8/3.32.5V 0.8mm PMIC MAX? 7000B Series EPM7512 2.5V 169-LFBGA (Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 169-LFBGA
Surface Mount YES
Operating Temperature 0°C~70°C TA
Packaging Tray
Series MAX® 7000B
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 169
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature YES
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 235
Supply Voltage 2.5V
Terminal Pitch 0.8mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number EPM7512
JESD-30 Code S-PBGA-B169
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Power Supplies 1.8/3.32.5V
Supply Voltage-Min (Vsup) 2.375V
Programmable Type In System Programmable
Number of I/O 141
Clock Frequency 163.9MHz
Propagation Delay 5.5 ns
Number of Gates 10000
Output Function MACROCELL
Number of Macro Cells 512
JTAG BST YES
Voltage Supply - Internal 2.375V~2.625V
Delay Time tpd(1) Max 10ns
Number of Logic Elements/Blocks 32
Height Seated (Max) 1.55mm
Length 11mm
Width 11mm
RoHS Status Non-RoHS Compliant

EPM7512BUC169-10 Overview


A mobile phone network consists of 512macro cells, which are radio coverage cells served by a high-power cell site (tower, antenna or mast).It is embedded in the 169-LFBGA package.The device has 141inputs and outputs.Terminations of devices are set to [0].The terminal position of this electrical part is BOTTOM, which serves as an important access point for passengers or freight.Power is supplied by a voltage of 2.5V volts.The part belongs to Programmable Logic Devices family.It is packaged in the way of Tray.The device operates at a temperature of 0°C~70°C TAin order to ensure its reliability.The chip should be mounted by Surface Mount.In this case, it is a type of FPGA belonging to the MAX? 7000B series.Additionally, this device is capable of displaying [0].EPM7512contains its related parts.In digital circuits, 10000gates serve as building blocks.32logic blocks/elements are present.A power supply of 1.8/3.32.5Vvolts is required to operate this device.In order to ensure proper operation, a maximum supply voltage (Vsup) of 2.625V is required.A supply voltage (Vsup) of greater than 2.375V should be used.Its clock frequency should not exceed 163.9MHz.

EPM7512BUC169-10 Features


169-LFBGA package
141 I/Os
The operating temperature of 0°C~70°C TA
1.8/3.32.5V power supplies

EPM7512BUC169-10 Applications


There are a lot of Intel EPM7512BUC169-10 CPLDs applications.

  • Cross-Matrix Switch
  • Wide Vin Industrial low power SMPS
  • POWER-SAVING MODES
  • Software-driven hardware configuration
  • D/T registers and latches
  • Pattern recognition
  • Complex programmable logic devices
  • ToR/Aggregation/Core Switch and Router
  • Power up sequencing
  • Preset swapping