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  • EPM7512BUC169-5

EPM7512BUC169-5

1.8/3.32.5V 0.8mm PMIC MAX? 7000B Series EPM7512 2.5V 169-LFBGA


  • Manufacturer: Intel
  • Origchip NO: 386-EPM7512BUC169-5
  • Package: 169-LFBGA
  • Datasheet: PDF
  • Stock: 787
  • Description: 1.8/3.32.5V 0.8mm PMIC MAX? 7000B Series EPM7512 2.5V 169-LFBGA (Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 169-LFBGA
Surface Mount YES
Operating Temperature 0°C~70°C TA
Packaging Tray
Series MAX® 7000B
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 169
ECCN Code 3A991
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature YES
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 235
Supply Voltage 2.5V
Terminal Pitch 0.8mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number EPM7512
JESD-30 Code S-PBGA-B169
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Power Supplies 1.8/3.32.5V
Supply Voltage-Min (Vsup) 2.375V
Programmable Type In System Programmable
Number of I/O 141
Clock Frequency 163.9MHz
Propagation Delay 5.5 ns
Number of Gates 10000
Output Function MACROCELL
Number of Macro Cells 512
JTAG BST YES
Voltage Supply - Internal 2.375V~2.625V
Delay Time tpd(1) Max 5.5ns
Number of Logic Elements/Blocks 32
Height Seated (Max) 1.55mm
Length 11mm
Width 11mm
RoHS Status Non-RoHS Compliant

EPM7512BUC169-5 Overview


512macrocells exist, which are cells in a mobile phone network that are primarily composed of high-power towers, antennas, or masts.The item is packaged with 169-LFBGA.This device has 141 I/O ports programmed into it.There are 169 terminations, which are the practice of ending a transmission line with a device that matches the characteristic impedance of the line.The terminal position of this electrical part is BOTTOM, which serves as an important access point for passengers or freight.A voltage of 2.5Vprovides power to the device.This part is in the family [0].It is recommended that the chip be packaged by Tray.It operates with the operating temperature of 0°C~70°C TA to ensure its reliability.There should be a Surface Mounton the chip.The MAX? 7000Bseries comprises this type of FPGA.This device also displays [0].The EPM7512indicates that related parts can be found.A digital circuit can be constructed using 10000gates.32logic elements/blocks exist.It operates from 1.8/3.32.5V power supplies.In this case, the maximum supply voltage (Vsup) is 2.625V.Vsup (supply voltage) must be greater than 2.375V.The clock frequency of this device should not exceed 163.9MHz.

EPM7512BUC169-5 Features


169-LFBGA package
141 I/Os
The operating temperature of 0°C~70°C TA
1.8/3.32.5V power supplies

EPM7512BUC169-5 Applications


There are a lot of Intel EPM7512BUC169-5 CPLDs applications.

  • Dedicated input registers
  • I/O expansion
  • Software Configuration of Add-In Boards
  • Page register
  • I2C BUS INTERFACE
  • Digital designs
  • Power automation
  • Software-Driven Hardware Configuration
  • ON-CHIP OSCILLATOR CIRCUIT
  • Preset swapping