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  • EPM7512BUC169-7

EPM7512BUC169-7

1.8/3.32.5V 0.8mm PMIC MAX? 7000B Series EPM7512 2.5V 169-LFBGA


  • Manufacturer: Intel
  • Origchip NO: 386-EPM7512BUC169-7
  • Package: 169-LFBGA
  • Datasheet: PDF
  • Stock: 887
  • Description: 1.8/3.32.5V 0.8mm PMIC MAX? 7000B Series EPM7512 2.5V 169-LFBGA (Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 169-LFBGA
Surface Mount YES
Operating Temperature 0°C~70°C TA
Packaging Tray
Series MAX® 7000B
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 169
ECCN Code 3A991
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature YES
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 235
Supply Voltage 2.5V
Terminal Pitch 0.8mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number EPM7512
JESD-30 Code S-PBGA-B169
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Power Supplies 1.8/3.32.5V
Supply Voltage-Min (Vsup) 2.375V
Programmable Type In System Programmable
Number of I/O 141
Clock Frequency 163.9MHz
Propagation Delay 5.5 ns
Number of Gates 10000
Output Function MACROCELL
Number of Macro Cells 512
JTAG BST YES
Voltage Supply - Internal 2.375V~2.625V
Delay Time tpd(1) Max 7.5ns
Number of Logic Elements/Blocks 32
Height Seated (Max) 1.55mm
Length 11mm
Width 11mm
RoHS Status Non-RoHS Compliant

EPM7512BUC169-7 Overview


There are 512 macro cells in the network, which are high-power cell sites that provide radio coverage (tower, antenna, or mast) for a mobile phone network.169-LFBGAis the package in which it resides.As a result, it has 141 I/O ports programmed.It is programmed that device terminations will be 169 .The terminal position of this electrical part is BOTTOM, which serves as an important access point for passengers or freight.A voltage of 2.5Vprovides power to the device.It belongs to the family [0].It is recommended that the chip be packaged by Tray.To ensure reliability, the device operates at a temperature of [0].It is recommended that the chip be mounted by Surface Mount.It belongs to the MAX? 7000Bseries of FPGAs.When using this device, YEScan also be found.You can find its related parts in the [0].For digital circuits, there are 10000gates. These devices serve as building blocks.This logic element/block contains 32logic elements.A power supply of 1.8/3.32.5Vvolts is required to operate this device.Supply voltage (Vsup) reaches a maximum of 2.625V.A supply voltage (Vsup) of greater than 2.375V should be used.The clock frequency should not exceed 163.9MHz.

EPM7512BUC169-7 Features


169-LFBGA package
141 I/Os
The operating temperature of 0°C~70°C TA
1.8/3.32.5V power supplies

EPM7512BUC169-7 Applications


There are a lot of Intel EPM7512BUC169-7 CPLDs applications.

  • ROM patching
  • Programmable power management
  • D/T registers and latches
  • Software-Driven Hardware Configuration
  • Synchronous or asynchronous mode
  • Voltage level translation
  • Auxiliary Power Supply Isolated and Non-isolated
  • Digital designs
  • SFP, QSFP, QSFP-DD, OSFP, Mini-SAS HD Port Management
  • High speed graphics processing