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GCE25DHFD

GCE25DHFD datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Sullins Connector Solutions stock available at Utmel


  • Manufacturer: Sullins Connector Solutions
  • Origchip NO: 765-GCE25DHFD
  • Package: -
  • Datasheet: PDF
  • Stock: 423
  • Description: GCE25DHFD datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Sullins Connector Solutions stock available at Utmel(Kg)

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Details

Tags

Parameters
Factory Lead Time 3 Weeks
Contact Material Phosphor Bronze
Mount Surface Mount
Mounting Type Surface Mount
Material - Insulation Polyamide (PA9T), Nylon 9T
Operating Temperature -65°C~125°C
Packaging Tube
Published 2016
JESD-609 Code e3
Part Status Active
Termination Solder
Connector Type Hairpin Bellows
Number of Positions 50
Color Black
Number of Rows 2
Gender Female
Subcategory Headers and Edge Type Connectors
Contact Type Hairpin Bellows
Pitch 0.039 1.00mm
Total Number of Contacts 50
Number of Conductors ONE
Reference Standard UL
Contact Finish Gold
Reliability COMMERCIAL
Body Length or Diameter 1.895 inch
Number Of PCB Rows 2
PCB Contact Pattern RECTANGULAR
Body Breadth 0.37 inch
Body Depth 0.61 inch
Rated Current (Signal) 1A
Card Type Non Specified - Dual Edge
Read Out Dual
Number of Positions/Bay/Row 25
Flange Feature Flush Mount, Top Opening, Unthreaded, 0.125 (3.18mm) Dia
Contact Finish Thickness 30.0μin 0.76μm
Plating Thickness 30μin
Card Thickness 0.062 1.57mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free

GCE25DHFD Overview


The material was packaged according to the specifications of Tube.A mounting type of Surface Mount is recommended.Connecting the device uses connector socket Hairpin Bellows.

GCE25DHFD Features



GCE25DHFD Applications


There are a lot of Sullins Connector Solutions GCE25DHFD Edgeboard Connectors applications.

  • Rotary encoder
  • In-building wireless telephony
  • Microcontrollers.
  • Communication test equipment
  • Multiplexed Data Acquisition Systems
  • Uninterrupted Power Supplies
  • Scientific instruments.
  • Battery Operated Systems
  • High Speed Data Acquisition
  • Communication Systems