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GMM18DSEN-S243
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Shipping Cost
Shipping starts at $40, but some countries will exceed $40. For
example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The
basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and
country.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
Delivery TimeOnce the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.
| Parameters | |
|---|---|
| Factory Lead Time | 3 Weeks |
| Contact Material | Phosphor Bronze |
| Mount | Free Hanging |
| Mounting Type | Free Hanging (In-Line) |
| Material - Insulation | Polyamide (PA9T), Nylon 9T |
| Operating Temperature | -65°C~125°C |
| Packaging | Tray |
| Published | 2008 |
| JESD-609 Code | e4 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Termination | Solder Eyelet(s) |
| Connector Type | Full Bellows |
| Number of Positions | 36 |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Subcategory | Headers and Edge Type Connectors |
| Contact Type | Full Bellows |
| Pitch | 0.156 3.96mm |
| Total Number of Contacts | 36 |
| Reference Standard | UL |
| Contact Finish | Gold |
| Reliability | COMMERCIAL |
| Body Depth | 0.431 inch |
| Rated Current (Signal) | 5A |
| Card Type | Non Specified - Dual Edge |
| Read Out | Single |
| Insulation Resistance | 5000000000Ohm |
| Number of Positions/Bay/Row | 18 |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Plating Thickness | 30μin |
| Card Thickness | 0.062 1.57mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
GMM18DSEN-S243 Overview
It was packaged based on Tray's specs.It's recommended to mount type Free Hanging (In-Line).This device is connected through the connector socket Full Bellows.
GMM18DSEN-S243 Features
GMM18DSEN-S243 Applications
There are a lot of Sullins Connector Solutions GMM18DSEN-S243 Edgeboard Connectors applications.
- Communications
- Medical Imaging
- CMOS Image sensors for mobile applications
- 4-channel data acquisition
- Audio/Video devices
- Microcontrollers.
- In-building wireless telephony
- Scientific instruments.
- High Speed Data Acquisition
- Battery Operated Systems