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HBM15DRAI

HBM15DRAI datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Sullins Connector Solutions stock available at Utmel


  • Manufacturer: Sullins Connector Solutions
  • Origchip NO: 765-HBM15DRAI
  • Package: -
  • Datasheet: PDF
  • Stock: 349
  • Description: HBM15DRAI datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Sullins Connector Solutions stock available at Utmel(Kg)

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Shipping Cost

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Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 3 Weeks
Contact Material Beryllium Copper
Mount Through Hole
Mounting Type Through Hole, Right Angle
Material - Insulation Polybutylene Terephthalate (PBT)
Operating Temperature -65°C~125°C
Packaging Tray
Published 2015
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
Connector Type Full Bellows
Number of Positions 30
Color Blue
Number of Rows 2
Gender Female
Subcategory Headers and Edge Type Connectors
Contact Type Full Bellows
Pitch 0.156 3.96mm
Total Number of Contacts 30
Number of Conductors ONE
Contact Finish Gold
Reliability COMMERCIAL
Number Of PCB Rows 2
PCB Contact Pattern RECTANGULAR
Body Depth 0.431 inch
Rated Current (Signal) 3A
Card Type Non Specified - Dual Edge
Read Out Dual
Number of Positions/Bay/Row 15
Flange Feature Top Mount Opening, Threaded Insert, 4-40
Contact Finish Thickness 10.0μin 0.25μm
Plating Thickness 10μin
Card Thickness 0.062 1.57mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free

HBM15DRAI Overview


Material was packaged in accordance with Tray's specifications.Recommended mounting type is Through Hole, Right Angle.Connecting the device uses connector socket Full Bellows.

HBM15DRAI Features



HBM15DRAI Applications


There are a lot of Sullins Connector Solutions HBM15DRAI Edgeboard Connectors applications.

  • Cell Phones
  • Wireless local loop
  • Micro and pico cell systems, software radios
  • 3-phase power control
  • High Speed Data Acquisition
  • Imaging Systems
  • Digital beam-forming systems for ultrasound
  • Music recording
  • Microcontrollers.
  • Data Acquisition Systems