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  • HC5513BIM

HC5513BIM

28 TerminationsTelecom device1 Circuits1 Functions


  • Manufacturer: Intersil (Renesas Electronics America)
  • Origchip NO: 391-HC5513BIM
  • Package: DIP
  • Datasheet: PDF
  • Stock: 320
  • Description: 28 TerminationsTelecom device1 Circuits1 Functions(Kg)

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Details

Tags

Parameters
Mount Through Hole
Package / Case DIP
Published 2000
JESD-609 Code e0
Moisture Sensitivity Level (MSL) 1
Number of Terminations 28
Terminal Finish Tin/Lead (Sn/Pb)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Subcategory Analog Transmission Interfaces
Technology BIPOLAR
Terminal Position QUAD
Terminal Form J BEND
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 5V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PQCC-J28
Qualification Status Not Qualified
Power Supplies +-5V
Temperature Grade INDUSTRIAL
Number of Circuits 1
Power Dissipation-Max 1.5W
Operating Supply Current 2.25mA
Telecom IC Type SLIC
Neg Supply Voltage-Nom -5V
Battery Feed CONSTANT CURRENT
Hybrid 2-4 CONVERSION
Battery Supply -28 V
Height Seated (Max) 4.57mm
RoHS Status RoHS Compliant

HC5513BIM Overview


A DIP package saves space on a board.A 1-circuit composes this telecom IC .Through Hole is mounted on telecom switching.In telecom switching configuration, there are 28 terminations.It requires a supply voltage of 5V.Telecom ICs are of type SLIC.Designers have a great deal of flexibility with this telecom circuit due to its operation with the supply current provided by 2.25mA.In the Analog Transmission Interfaces subcategory, telecommunications device belongs.A minimum temperature value -40°C is set to ensure normal operation.It is necessary to set the temperature at the maximum value of 85°C for the telecom IC to function normally.Telecommunications device is configured wit h 1 functions when designing.

HC5513BIM Features


Available in the DIP package
SLIC as telecom IC type
Operating supply current of 2.25mA

HC5513BIM Applications


There are a lot of Intersil (Renesas Electronics America) HC5513BIM Telecom applications.

  • E1 Rates PCM Line Interface
  • ISDN Primary Rate Interface
  • Integrated Multi-Service Access Platforms (IMAPs)
  • CSU/DSU E1 Interface
  • PCM Test Equipment
  • SDH/SONET multiplexers
  • ATM equipment with integrated DS1 interfaces
  • Short/Medium Loop
  • Switches
  • Channel Banks