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HT19LG-G

8 Terminations8 Pin HT19 Telecom device1 CircuitsMin 2.7V VMax 5.25V V


  • Manufacturer: Microchip Technology
  • Origchip NO: 536-HT19LG-G
  • Package: 8-SOIC (0.154, 3.90mm Width)
  • Datasheet: PDF
  • Stock: 725
  • Description: 8 Terminations8 Pin HT19 Telecom device1 CircuitsMin 2.7V VMax 5.25V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 14 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 8
Weight 540.001716mg
Operating Temperature 0°C~50°C
Packaging Tape & Reel (TR)
Published 2014
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
Terminal Finish MATTE TIN
Max Power Dissipation 800mW
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 2.3V
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number HT19
Function Switch
Qualification Status Not Qualified
Number of Circuits 1
Max Supply Voltage 5.25V
Min Supply Voltage 2.7V
Length 4.9mm
Width 3.9mm
RoHS Status ROHS3 Compliant

HT19LG-G Overview


A 8-SOIC (0.154, 3.90mm Width) package saves space on a board.In order to pack telecommunications equipment, Tape & Reel (TR) is used.A Surface Mount mounting type is used.A 1-circuit composes this telecom IC .0°C~50°C is the operating temperature that can be set for reliable performance.Mounted in the direction of Surface Mount.There are 8 terminations can be found in telecom switching configuration.It requires a supply voltage of 2.3V.An interface with 8 pins is present on this telecom interface.Telecom switching's base part number of HT19 can be used to find more related parts.2.7V is the minimum voltage that should be supplied.A lower voltage than 5.25V should be supplied.

HT19LG-G Features


Available in the 8-SOIC (0.154, 3.90mm Width) package

HT19LG-G Applications


There are a lot of Microchip Technology HT19LG-G Telecom applications.

  • Switches
  • Interfaces to SONET STS-1 Networks
  • PBX interfaces
  • CSU/DSU Equipment
  • Integrated Multi-Service Access Platforms (IMAPs)
  • Digital Cross Connect Systems
  • Frame Relay Switches and Access Devices (FRADS)
  • ATM Switches
  • DSLAMs
  • DECT (Digital European Cordless Telephone) Base Stations