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IDT7201LA15SOI
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Shipping Cost
Shipping starts at $40, but some countries will exceed $40. For
example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The
basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and
country.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
Delivery TimeOnce the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 28-SOIC (0.345, 8.77mm Width) |
| Operating Temperature | -40°C~85°C |
| Packaging | Tube |
| Series | 7200 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 4.5V~5.5V |
| Base Part Number | 7201 |
| Function | Asynchronous |
| Current - Supply (Max) | 80mA |
| Memory Size | 4.5K 512 x 9 |
| Access Time | 15ns |
| Data Rate | 40MHz |
| Bus Directional | Uni-Directional |
| Retransmit Capability | Yes |
| Programmable Flags Support | No |
| Expansion Type | Depth, Width |
| RoHS Status | Non-RoHS Compliant |
IDT7201LA15SOI Overview
You can find FIFO memory chip in package 28-SOIC (0.345, 8.77mm Width) .Tube case is used for packaging.In addition, the FIFO chip has a memory capacity of 4.5K 512 x 9 , which can be used to store applications and data.A temperature regulation of -40°C~85°C is crucial for reliable operation.Surface Mount is the mounting type of the FIFO memory.It uses a supply voltage of 4.5V~5.5V to operate.It is a member of the 7200 series .It has a maximum operating supply current of 80mA .I believe it belongs to the 7201 family of numbers.
IDT7201LA15SOI Features
4.5K 512 x 9 memory size
7200 series
Best part number of 7201
IDT7201LA15SOI Applications
There are a lot of Renesas Electronics America Inc. IDT7201LA15SOI FIFOs Memory applications.
- Industrial Systems
- Fabrication Site
- Product traceability
- Temporary storage elements
- Digital buffering
- Extended product life cycle
- Notebook
- Networking
- Thermal Management for DDR3 Memory Modules
- Microprogramming