English

All Products

View All >>
  • IDT72T40108L10BB

IDT72T40108L10BB

208 Terminations2.5V 208 Pin FIFO memory IC10 ns Min 2.375V VMax 2.625V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-IDT72T40108L10BB
  • Package: BGA
  • Datasheet: PDF
  • Stock: 593
  • Description: 208 Terminations2.5V 208 Pin FIFO memory IC10 ns Min 2.375V VMax 2.625V V(Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Mount Surface Mount
Package / Case BGA
Number of Pins 208
Published 2009
JESD-609 Code e0
Moisture Sensitivity Level (MSL) 3
Number of Terminations 208
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature ALTERNATIVE MEMORY WIDTH: 10 AND 20
HTS Code 8542.32.00.71
Subcategory FIFOs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 2.5V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 208
Qualification Status Not Qualified
Operating Supply Voltage 2.5V
Temperature Grade COMMERCIAL
Max Supply Voltage 2.625V
Min Supply Voltage 2.375V
Element Configuration Dual
Nominal Supply Current 60mA
Access Time 10 ns
Direction Unidirectional
Organization 64KX40
Memory Width 40
Density 2.5 Mb
Standby Current-Max 0.05A
Parallel/Serial PARALLEL
Sync/Async Synchronous
Word Size 40b
Memory IC Type OTHER FIFO
Output Enable YES
Height Seated (Max) 1.97mm
Length 17mm
Width 17mm
RoHS Status Non-RoHS Compliant

IDT72T40108L10BB Overview


FIFO memory chip can be found in the BGA package.Surface Mount is recommended as the mounting method.When the supply voltage is 2.5V there is the possibility of high efficiency.The number of terminations in FIFO means is 208 .208 pins are used for operation.The supply voltage should be set to 2.5V in order to achieve FIFO's maximum efficiency.The FIFO products must be run at a minimum temperature of 0°C degrees Celsius to ensure reliability.70°C °C is the memory logic's maximum operating temperature that allows stable operation.It is contained within FIFOs .This part has a memory type of OTHER FIFO .In some cases, FIFO operates at a very low supply voltage, such as 2.375V V.FIFO memory is capable of handling a maximum supply voltage of 2.625V volts.There are a total of 208 pins on this board.With a frequency of 100MHz , it maintains good accuracy.This gadget can also be used to generate ALTERNATIVE MEMORY WIDTH: 10 AND 20 .

IDT72T40108L10BB Features


FIFOs category

IDT72T40108L10BB Applications


There are a lot of Integrated Device Technology (IDT) IDT72T40108L10BB FIFOs Memory applications.

  • Data-acquisition systems
  • High-speed disk
  • Signal processing
  • TVs
  • Test site
  • Seismic Data Collection at Extreme Temperatures
  • Data communications
  • Computer networks
  • Video
  • Tape controllers