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  • IDT72T40108L5BB

IDT72T40108L5BB

72T40108 FIFO memory IC72T Series 2.5M 64K x 403.6ns


  • Manufacturer: Renesas Electronics America Inc.
  • Origchip NO: 668-IDT72T40108L5BB
  • Package: 208-BGA
  • Datasheet: PDF
  • Stock: 517
  • Description: 72T40108 FIFO memory IC72T Series 2.5M 64K x 403.6ns (Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 208-BGA
Supplier Device Package 208-PBGA (17x17)
Operating Temperature 0°C~70°C
Packaging Tray
Series 72T
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 2.375V~2.625V
Base Part Number 72T40108
Function Synchronous
Current - Supply (Max) 60mA
Memory Size 2.5M 64K x 40
Access Time 3.6ns
Data Rate 200MHz
Bus Directional Uni-Directional
Retransmit Capability Yes
FWFT Support Yes
Programmable Flags Support Yes
Expansion Type Depth, Width
RoHS Status Non-RoHS Compliant

IDT72T40108L5BB Overview


The 208-BGA package contains FIFO memory chip.The package comes in a case of Tray .There is a memory of 2.5M 64K x 40 on the FIFO chip that can be used to store applications and data.To ensure reliable operation, the temperature should be regulated to 0°C~70°C .Surface Mount is the mounting type of the FIFO memory.Operation is based on a supply voltage of 2.375V~2.625V .A component in the 72T series, this is an memory logic.There is a maximum operating current of 60mA in memory IC's supply.In addition, it is among the members of the 72T40108 family.

IDT72T40108L5BB Features


2.5M 64K x 40 memory size
72T series
Best part number of 72T40108

IDT72T40108L5BB Applications


There are a lot of Renesas Electronics America Inc. IDT72T40108L5BB FIFOs Memory applications.

  • Transistors
  • General Data Collection Applications at Extreme High-Temperatures
  • Code converters
  • Signal processing
  • Thermal Management for DDR3 Memory Modules
  • Test site
  • Multimedia
  • Temporary storage elements
  • Data communications
  • Desktop Computers