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  • IDT72T40118L4BBG

IDT72T40118L4BBG

208 TerminationsFIFO memory IC4 ns


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-IDT72T40118L4BBG
  • Package: BGA
  • Datasheet: PDF
  • Stock: 637
  • Description: 208 TerminationsFIFO memory IC4 ns (Kg)

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Details

Tags

Parameters
Mount Surface Mount
Package / Case BGA
Published 2009
JESD-609 Code e1
Moisture Sensitivity Level (MSL) 3
Number of Terminations 208
ECCN Code EAR99
Terminal Finish TIN SILVER COPPER
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature ALTERNATIVE MEMORY WIDTH: 10 AND 20
HTS Code 8542.32.00.71
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 2.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 208
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 2.375V
Operating Mode SYNCHRONOUS
Access Time 4 ns
Organization 128KX40
Memory Width 40
Memory Density 5242880 bit
Parallel/Serial PARALLEL
Output Enable YES
Height Seated (Max) 1.97mm
Length 17mm
Width 17mm
RoHS Status RoHS Compliant

IDT72T40118L4BBG Overview


BGA is a package that contains FIFO memory chip.Mounting it Surface Mount is recommended.When the supply voltage is 2.5V , high efficiency is possible.FIFO consists of 208 terminations, which indicates that FIFO means is empty.This FIFO products runs at 0°C degrees Celsius at a minimum temperature to ensure reliability.70°C °C is the memory logic's maximum operating temperature that allows stable operation.This FIFO memory IC is equipped with 208 pins in total.With the help of this FIFO memory, ALTERNATIVE MEMORY WIDTH: 10 AND 20 can also be generated.Voltage FIFO memory IC's maximum is set to 2.625V .The supply voltage (Vsup) should remain above 2.375V to ensure normal operation.

IDT72T40118L4BBG Features



IDT72T40118L4BBG Applications


There are a lot of Integrated Device Technology (IDT) IDT72T40118L4BBG FIFOs Memory applications.

  • General Data Collection Applications at Low-Temperatures
  • Code converters
  • One assembly
  • Consumer
  • Multi-stage synchronizer
  • Temporary storage elements
  • Communications Systems
  • Game Consoles
  • Routers
  • Cardiac Monitoring Device