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IDT72V3682L10PFG

120 TerminationsFIFO memory IC10 ns


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-IDT72V3682L10PFG
  • Package: LQFP
  • Datasheet: PDF
  • Stock: 896
  • Description: 120 TerminationsFIFO memory IC10 ns (Kg)

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Details

Tags

Parameters
Mount Surface Mount
Package / Case LQFP
Published 2009
JESD-609 Code e3
Moisture Sensitivity Level (MSL) 3
Number of Terminations 120
ECCN Code EAR99
Terminal Finish Matte Tin (Sn) - annealed
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature MAIL BOX BYPASS REGISTER
HTS Code 8542.32.00.71
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 0.4mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 120
JESD-30 Code S-PQFP-G120
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.45V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 3.15V
Operating Mode SYNCHRONOUS
Access Time 10 ns
Organization 16KX36
Memory Width 36
Memory Density 589824 bit
Parallel/Serial PARALLEL
Output Enable YES
Height Seated (Max) 1.6mm
Length 14mm
Width 14mm
RoHS Status RoHS Compliant

IDT72V3682L10PFG Overview


LQFP is a package that contains FIFO memory chip.Mounting it in the Surface Mount way is recommended.When the supply voltage is 3.3V , high efficiency is possible.As a result of this, FIFO means contains 120 terminations.This FIFO products runs at 0°C degrees Celsius at a minimum temperature to ensure reliability.70°C °C is the memory logic's maximum operating temperature that allows stable operation.It has a total of 120 pins on it.Additionally, this FIFO memory can be used to generate MAIL BOX BYPASS REGISTER .The FIFO memory IC's maximum supply voltage is set to 3.45V .To ensure normal operation, the supply voltage should be greater than 3.15V (Vsup).

IDT72V3682L10PFG Features



IDT72V3682L10PFG Applications


There are a lot of Integrated Device Technology (IDT) IDT72V3682L10PFG FIFOs Memory applications.

  • Computer Systems
  • Optical memories
  • Video Processing
  • Multimedia
  • Transistors
  • Telecommunication
  • Queues for communication systems
  • Thermal Management for DDR3 Memory Modules
  • Digital buffering
  • Wireless