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IDT72V3694L10PFG8
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Shipping Cost
Shipping starts at $40, but some countries will exceed $40. For
example (South Africa, Brazil, India, Pakistan, Israel, etc.)
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basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and
country.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
Delivery TimeOnce the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 128-LQFP |
| Supplier Device Package | 128-TQFP (14x20) |
| Operating Temperature | 0°C~70°C |
| Packaging | Tape & Reel (TR) |
| Series | 72V |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3.15V~3.45V |
| Base Part Number | 72V3694 |
| Function | Synchronous |
| Current - Supply (Max) | 400mA |
| Memory Size | 2.25M 32K x 36 x 2 |
| Access Time | 6.5ns |
| Data Rate | 100MHz |
| Bus Directional | Bi-Directional |
| Retransmit Capability | Yes |
| FWFT Support | Yes |
| Programmable Flags Support | Yes |
| Expansion Type | Width |
IDT72V3694L10PFG8 Overview
FIFO memory chip is contained in the 128-LQFP package.You'll find it packaged in the shape of a Tape & Reel (TR) .There is a 2.25M 32K x 36 x 2 MB memory on the FIFO chips, which can be used to store both applications and data.Reliable operation requires a temperature of 0°C~70°C .This FIFO memory has a mounting type of Surface Mount .Operating voltage is 3.15V~3.45V .It is a member of the 72V series .It has a maximum operating supply current of 400mA .Memory IC belongs to the 72V3694 family.
IDT72V3694L10PFG8 Features
2.25M 32K x 36 x 2 memory size
72V series
Best part number of 72V3694
IDT72V3694L10PFG8 Applications
There are a lot of Renesas Electronics America Inc. IDT72V3694L10PFG8 FIFOs Memory applications.
- SPD for DDR3 Memory Modules
- Communications
- IP Radio
- Video
- Battery Charger
- Portable Information Devices
- Data-acquisition systems
- Extended product life cycle
- General Data Collection Applications at Extreme High-Temperatures
- Portable Information Devices