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KMC8112TMP2400V

CPLD StarCore Series MC8112 431-BFBGA, FCBGA


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-KMC8112TMP2400V
  • Package: 431-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 200
  • Description: CPLD StarCore Series MC8112 431-BFBGA, FCBGA (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 431-BFBGA, FCBGA
Supplier Device Package 431-FCPBGA (20x20)
Operating Temperature -40°C~105°C TJ
Packaging Tray
Published 2006
Series StarCore
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type SC140 Core
Base Part Number MC8112
Interface Ethernet, I2C, TDM, UART
Voltage - I/O 3.30V
Non-Volatile Memory External
Voltage - Core 1.10V
On Chip Data RAM 448kB
Clock Rate 300MHz
RoHS Status Non-RoHS Compliant

KMC8112TMP2400V Overview


It is a type of electronic component available in package 431-BFBGA, FCBGA.Packaging way Tray is provided.SC140 Core members are well suited for a wide range of applications.Surface Mount is the direction in which it is mounted.If it is operating at the temperature of -40°C~105°C TJ, then it will be operating normally.This refers to the analog voltage range that can be input or output from 3.30V.StarCore series digital signal processors contain this digital signal processor.Several related parts can be identified using its base part number, MC8112.

KMC8112TMP2400V Features


Supplied in the 431-BFBGA, FCBGA package

KMC8112TMP2400V Applications


There are a lot of NXP USA Inc. KMC8112TMP2400V DSP applications.

  • Airplanes
  • Encoding/broadcast
  • Speech processing
  • Voice recognition
  • Speech processing and recognition
  • Smart phones
  • Other sensor array processing
  • Digital hardware
  • Audio
  • Remote sensing image processing technology