LCMXO2-7000HE-4BG256C

LCMXO2-7000HE-4BG256C Overview

There are two packages that contain fpga chips: 256-LFBGA package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. Power is provided by a 1.2V-volt supply. There is a Field Programmable Gate Arrays family component in this FPGA part. This FPGA module can be attached to the development board with a Surface Mount. In order to operate it, it requires a voltage supply of 1.14V~1.26V . It is a type of FPGA belonging to the MachXO2 seies. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~85°C TJ at all times. A total of 207 outputs are incorporated into this device. There is an FPGA model contained in Tray in order to conserve space. As a whole, it has 256 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 245760 bFpga chipss. Its base part number LCMXO2-7000 can be used to find parts that are related to it. This cable has 256 pins and is designed to connect to a computer. The FPGA consists of 858 LABs/CLBs. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. A 1.2V-volt supply allows designers to fully utilize its flexibility. For storing programs and data, this FPGA module embeds memory 68.8kB. Fpga semiconductor is possible for this FPGA to reach speeds of up to 269MHz. It operates at 189μA amps of supply current. There are 3432 macro cells which make up this CPLD and they serve as the main components of the device.

LCMXO2-7000HE-4BG256C Features

206 I/Os
Up to 245760 RAM bits
256 LABs/CLBs

LCMXO2-7000HE-4BG256C Applications

There are a lot of Lattice Semiconductor Corporation LCMXO2-7000HE-4BG256C FPGAs applications.

• Artificial intelligence (AI)
• Scientific Instruments
• Electronic Warfare
• ADAS
• Cryptography
• Distributed Monetary Systems
• Medical ultrasounds
• Military Temperature
• ASIC prototyping
• Industrial Ethernet